Apparatus for bonding clip, method of bonding clip, and semiconductor package including semiconductor chip to which clip is bonded using the method

A method of bonding clips comprising:

• preparing a lead frame array comprising the lead frames, wherein the lead frames, to which at least one semiconductor chip is to be bonded, are arranged and spaced apart from each other by X1 and Y1 pitch interval in an X-axis direction and an Y-axis direction;
• preparing a clip array comprising a plurality of clips and the tie bars, wherein the plurality of clips is arranged and spaced apart from each other by X2 and Y2 pitch interval which is smaller than any one of X1 and Y1 pitch interval in an X-axis direction and an Y-axis direction and the tie bars connect each of the plurality of clips;
• separating the plurality of clips into at least two individual clips using a punch member by cutting the tie bars, wherein the punch member comprises at least two punches and punch holders that hold the punches;
• guiding punching of the punches and accommodating the separated individual clip by using the die member, wherein the die member comprises at least two die holes and withdrawal guiding units which are formed to face the inner wall surface of the die hole and are opened at a fixed angle from the lower inner wall surface, where the punches are entered, toward the upper inner wall surface;
• and
• bonding the at least two individual clips attached to the picker heads sequentially to the upper surface of the semiconductor chips by using the clip picker member, wherein the clip picker member comprises a multi-picker head comprising a plurality of picker heads and a picker holder that holds the multi-picker head and thereby, respectively vacuum adsorbs individual clip separated by being entered to the die holes and vacuum releases the individual clip to the semiconductor chips on the lead frame.