Semiconductor device
AssigneeFujitsu Limited
InventorsKaname Ozawa, Hayato Okuda, Tetsuya Hiraoka, Mitsutaka Sato, Yuji Akashi, Akira Okada, Masahiko Harayama
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Abstract
A semiconductor device includes a substrate provided with a plurality of leads, a face-down semiconductor element provided on one surface of the substrate, a first stacked semiconductor element and a second stacked semiconductor element provided on another surface of the substrate and connected to the substrate by wires, and an extended wiring mechanism for connecting electrodes of the face-down semiconductor element and electrodes of the first and second semiconductor elements. The connected electrodes are equi-electrodes whose electrical characteristics are equal.
Claims8
A semiconductor device comprising:
- a substrate having a plurality of flip-chip pads formed on a first surface thereof and a plurality of wire bonding pads formed on a second surface thereof;
- a first semiconductor element provided on said first surface of said substrate via the flip-chip pads in a face-down state;
- a second semiconductor element provided on said second surface, opposite to said first surface, of said substrate in a face-up state and electrically connected to said wire bonding pads by wires;
- and
- an extended wiring mechanism formed on said substrate for connecting the flip-chip pads and the respective wire bonding pads to each other, the connected flip-chip pads and the wire bonding pads corresponding to equi-electrodes whose electrical characteristics are equal.
The semiconductor device as claimed in 2, wherein said connecting terminals are solder balls, said solder balls being formed to be in electrical connection with said extended wiring mechanism.
Dependencies are inferred from the claim text.