H10W 72/07173
Means for moving chips, wafers or other parts
Official title: {Means for moving chips, wafers or other parts, e.g. conveyor belts}
H10W72/07173 (Means for moving chips, wafers or other parts) appears on 838 US grants and 866 published applications in this corpus.
Search patents in H10W- Granted patents
- 838
- Published applications
- 866
- Assignees
- 319
- Inventors
- 1,672
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 2 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 2 | 0 |
| 1982 | 2 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 3 | 0 |
| 1988 | 3 | 0 |
| 1989 | 4 | 0 |
| 1990 | 4 | 0 |
| 1991 | 3 | 0 |
| 1992 | 8 | 0 |
| 1993 | 5 | 0 |
| 1994 | 7 | 0 |
| 1995 | 7 | 0 |
| 1996 | 5 | 0 |
| 1997 | 4 | 0 |
| 1998 | 8 | 0 |
| 1999 | 12 | 0 |
| 2000 | 22 | 0 |
| 2001 | 21 | 8 |
| 2002 | 21 | 19 |
| 2003 | 8 | 10 |
| 2004 | 7 | 24 |
| 2005 | 15 | 21 |
| 2006 | 11 | 23 |
| 2007 | 23 | 24 |
| 2008 | 12 | 24 |
| 2009 | 21 | 16 |
| 2010 | 15 | 18 |
| 2011 | 14 | 13 |
| 2012 | 17 | 32 |
| 2013 | 19 | 31 |
| 2014 | 13 | 22 |
| 2015 | 28 | 54 |
| 2016 | 34 | 43 |
| 2017 | 39 | 53 |
| 2018 | 50 | 63 |
| 2019 | 57 | 61 |
| 2020 | 55 | 70 |
| 2021 | 47 | 60 |
| 2022 | 50 | 43 |
| 2023 | 55 | 32 |
| 2024 | 41 | 41 |
| 2025 | 37 | 35 |
| 2026 | 19 | 26 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- IC chip mounting device and IC chip mounting method29 Sep 2026US 12,751,255 B2Sato Holdings Kabushiki Kaisha/ Sato Corporation
- Method of assembly by direct bonding of electronic components25 Aug 2026US 12,721,248 B2Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Pick and place method with detecting an event18 Aug 2026US 12,713,956 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Solder reflow apparatus and method of manufacturing an electronic device4 Aug 2026US 12,697,671 B2Samsung Electronics Co., Ltd.
- System and method for fluxless thermocompression bonding4 Aug 2026US 12,702,038 B2Asmpt Singapore Pte. Ltd.
- Mounting head and mounting apparatus having the mounting head1 Oct 2026US 2026/0305436 A1Shibaura Mechatronics Corporation
- Chip holding tool, chip holding device, and device for manufacturing semiconductor device10 Sep 2026US 2026/0271674 A1Tokyo University of Science Foundation
- Automatic wire threading method and system27 Aug 2026US 2026/0250097 A1Asmpt Singapore Pte. Ltd.
- Method and apparatus for determining a positioning error of a pickable component27 Aug 2026US 2026/0255919 A1
- Soldering device and tabbing device comprising same6 Aug 2026US 2026/0231806 A1Hanwha Solutions Corporation
Most cited
By later US patents
- Methods for surface attachment of flipped active componenets316US 8,889,485 B2Semprius, Inc. · 2014
- Web process interconnect in electronic assemblies249US 6,468,638 B2Alien Technology Corporation · 2002
- Methods for fabricating a multiple modular assembly213US 6,316,278 B1Alien Technology Corporation · 2001
- Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices177US 7,259,030 B2Articulated Technologies, LLC · 2007
- Method and apparatus for fabricating semiconductor device172US 6,159,770 AFujitsu Limited · 2000