Mounting head and mounting apparatus having the mounting head
AssigneeShibaura Mechatronics Corporation
InventorsTakuya OHE, Toshifumi OKAWARA, Naoki SETO, Kyota KUROIWA
Life of this patent
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AssigneeShibaura Mechatronics Corporation
InventorsTakuya OHE, Toshifumi OKAWARA, Naoki SETO, Kyota KUROIWA
Estimating the term…
According to an embodiment, a mounting head includes a collet having at least one suction hole at a contact surface configured to be in contact with a semiconductor electronic component so that the semiconductor electronic component is curved, and a supporting unit supporting the collet so that the contact surface of the collet is exposed. The supporting unit is configured to supply a gas toward a substrate from outside the contact surface of the collet. The supporting unit may have at least one gas-supplying hole for supplying the gas.
A mounting head for mounting a semiconductor electronic component onto a substrate, the mounting head comprising:
Dependencies are inferred from the claim text.