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AssigneeFujitsu Limited
InventorsMasafumi Tetaka, Shinichiro Maki, Nobuo Ohyama, Seiichi Orimo, Hideharu Sakoda, Yoshiyuki Yoneda, Akihiro Shigeno, Ryoichi Yokoyama, Fumitoshi Fujisaki, Masao Fukunaga, Kazuto Tsuji, Terumi Kamifukumoto, Kenji Itasaka, Masanori Onodera
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There is provided a method for fabricating semiconductor devices including resin packages sealing semiconductor elements and external connection terminals respectively resin projections formed on the resin packages and metallic film parts provided to the resin projections. The semiconductor elements are mounted to a lead frame having recess portions located in positions corresponding to positions of the resin projections, metallic film parts being provided in the recess portions. The semiconductor elements are electrically connected to the metallic film parts. The resin packages that seal the semiconductor elements and gate portions are integrally formed with the resin packages. The lead frame is etched so that the resin packages are separated from the lead frame together with the metallic layer parts. The resin packages are attached to an adhesive tape provided to a frame and being used as a carrier.
A method for fabricating semiconductor devices including resin packages sealing semiconductor elements and external connection terminals respectively resin projections formed on the resin packages and metallic film parts provided to the resin projections, said method comprising the steps of:
A method for fabricating semiconductor devices including resin packages sealing semiconductor elements and external connection terminals respectively having resin projections formed on the resin packages and metallic film parts provided to the resin projections, said method comprising the steps of:
Dependencies are inferred from the claim text.