Chip holding tool, chip holding device, and device for manufacturing semiconductor device

A chip holding tool, comprising:

• a holding surface holding a semiconductor chip in a non-contact manner;
• a suction path applying negative pressure to the holding surface and drawing the semiconductor chip by suction;
• and
• an oscillation generation part applying ultrasonic oscillation to the holding surface, wherein
• the suction path has a suction hole formed on the holding surface and communicating with a suction source, and
• the holding surface is formed with an airflow formation groove that connects to the suction hole and extends in a surface direction.

A chip holding device, for holding a semiconductor chip in a non-contact manner, the chip holding device comprising:

• a chip holding tool holding the semiconductor chip in a non-contact manner;
• an ultrasonic generation part applying ultrasonic oscillation to a holding surface that is an end surface of the chip holding tool;
• a suction path applying negative pressure to a suction hole formed on the holding surface to generate a suction force;
• and
• a controller controlling ultrasonic energy or the suction force so that a holding force generated by the ultrasonic oscillation, the suction force, and gravity acting on the semiconductor chip are balanced in a state where the semiconductor chip is separated from the holding surface.

A chip holding device, for holding a semiconductor chip in a non-contact manner, the chip holding device comprising:

• a chip holding tool holding the semiconductor chip in a non-contact manner;
• an ultrasonic generation part applying ultrasonic oscillation to a holding surface that is an end surface of the chip holding tool;
• a suction path applying negative pressure to a suction hole formed on the holding surface to generate a suction force;
• a controller controlling driving of the ultrasonic generation part and a suction source so that a holding force generated by the ultrasonic oscillation, the suction force, and gravity acting on the semiconductor chip are balanced in a state where the semiconductor chip is separated from the holding surface;
• and
• at least one of a surface processing device that applies processing to a surface of the semiconductor chip held in a non-contact manner by the holding surface, and an inspection device that inspects the surface.

A device for manufacturing a semiconductor device, the device comprising:

• a chip holding tool holding a semiconductor chip in a non-contact manner;
• an ultrasonic generation part applying ultrasonic oscillation to a holding surface that is an end surface of the chip holding tool;
• a suction path applying negative pressure to a suction hole formed on the holding surface to generate a suction force;
• and
• a controller controlling driving of the ultrasonic generation part and a suction source so that a holding force generated by the ultrasonic oscillation, the suction force, and gravity acting on the semiconductor chip are balanced in a state where the semiconductor chip is separated from the holding surface, wherein
• a size of an outer shape of the holding surface is larger than a size of an outer shape of the semiconductor chip.