Solder reflow apparatus and method of manufacturing an electronic device

A method of manufacturing a semiconductor package, the method comprising:

• disposing an electronic device on a substrate via a solder;
• loading the substrate on a substrate stage within a vapor generating chamber that accommodates a heat transfer fluid on a bottom of the vapor generating chamber;
• providing a first plate and a second plate that are sequentially arranged from the bottom of the vapor generating chamber, wherein an inner space of the vapor generating chamber is divided, via the first plate and the second plate, into an upper zone, a middle zone and a lower zone;
• heating the heat transfer fluid to generate saturated vapor within the vapor generating chamber;
• maintaining a first temperature at the upper zone, a second temperature at the middle zone and a third temperature at the lower zone, wherein the third temperature is higher than the second temperature and the second temperature is higher than the first temperature;
• and
• moving the substrate on the substrate stage through the upper zone, the middle zone and the lower zone, to thereby obtain a desired solder temperature profile.

A method of manufacturing a semiconductor package, comprising:

• providing a substrate stage within a vapor generating chamber that accommodates a heat transfer fluid and in which a saturated vapor generated from the heat transfer fluid is distributed based on a density difference;
• loading a substrate on the substrate stage, wherein an electronic device is mounted via a solder;
• providing at least one mesh plate that extends in a horizontal direction in the vapor generating chamber to divide an inner space of the vapor generating chamber into an upper zone and a lower zone, wherein the at least one mesh plate includes a plurality of openings through which the vapor moves and a plurality of cover members that are operable in a retractable manner to allow movement of the substrate stage;
• heating the heat transfer fluid to generate the saturated vapor within the vapor generating chamber;
• and
• moving the substrate on the substrate stage through the upper zone and the lower, to thereby obtain a desired solder temperature profile,
• wherein the plurality of cover members comprise a pair of first cover members spaced apart from each other and configured to form a space that allows the movement of the substrate stage.