System and method for fluxless thermocompression bonding

A bonding system for bonding an electronic component to a base member during a thermocompression bonding process, the bonding system comprising:

• a first container for forming a first inert gas environment where the base member is locatable during bonding of the electronic component,
• a first plasma cleaning device disposed in the first container and operative to clean the electronic component or clean both the electronic component and the base member by removing metal oxides but not organic contaminants therefrom,
• a second plasma cleaning device disposed in a second container different from the first container and operative to clean the electronic component by removing organic contaminants but not metal oxides therefrom, wherein the electronic component is sequentially conveyed from the second container to the first container, such that removal of organic contaminants and removal of metal oxides are performed in different containers and in different respective processes, and
• a bond head movably installed in the first container, the bond head being operative to bond the electronic component to the base member after the electronic component and the base member have been cleaned by the first plasma cleaning device.