Pick and place method with detecting an event
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorJen-Yuan Chang
Life of this patent
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Abstract
A pick and place method includes providing at least one semiconductor element disposed on a source storage location, picking up the at least one semiconductor element from the source storage location, transferring the at least one semiconductor element to a temporary storage device according to a signal, positioning the at least one semiconductor element via the temporary storage device, and picking up the positioned semiconductor element from the temporary storage device and placing the positioned semiconductor element on a destination storage location.
Claims20
A pick and place method, comprising:
- (a) providing at least one semiconductor element disposed on a source storage location;
- (b) picking up the at least one semiconductor element from the source storage location;
- (c) transferring the at least one semiconductor element to a temporary storage device according to a signal, wherein the temporary storage device includes a platform having a cavity recessed from a top surface of the platform;
- (d) positioning the at least one semiconductor element over the cavity of the temporary storage device, an edge of a bottom surface of the at least one semiconductor element is disposed on the top surface of the platform, such that the bottom surface of the at least one semiconductor element extends across the cavity and is spaced apart from a bottom surface of the cavity by a recessing depth of the cavity to prevent the bottom surface of the at least one semiconductor element from being damaged by the platform;
- and
- (e) picking up the positioned semiconductor element from the temporary storage device and placing the positioned semiconductor element on a destination storage location.
A pick and place method, comprising:
- (a) picking up at least one semiconductor element by a picked-up head, wherein the at least one semiconductor element comprises a circuit layer over a substrate and a bonding pad on the circuit layer;
- (b) sending a signal to the picked-up head after detecting an event;
- and
- (c) placing the at least one semiconductor element on a temporary storage device according to the signal, wherein the temporary storage device includes a platform having a cavity recessed from a top surface of the platform, and the at least one semiconductor element is placed on the top surface of the platform and over the cavity, such that a bottom surface of the at least one semiconductor element extends across the cavity, and the bonding pad is spaced apart from a bottom surface of the cavity by at least a depth of the cavity.
A pick and place method, comprising:
- (a) picking up the at least one semiconductor element by a picked-up head;
- (b) sending a signal to the picked-up head after detecting an event;
- (c) transferring the at least one semiconductor element to a temporary storage device according to a signal, wherein the temporary storage device includes a platform having a cavity recessed from a top surface of the platform;
- (d) positioning the at least one semiconductor element on the top surface of the platform and over the cavity according to a detection result of a position of the at least one semiconductor element, such that a bottom surface of the at least one semiconductor element extends across the cavity and is spaced apart from a bottom surface of the cavity by a vertical distance between the top surface of the platform and the bottom surface of the cavity;
- and
- (e) picking up and transferring the positioned semiconductor element by the picked-up head to a destination storage location.
Dependencies are inferred from the claim text.