H10W 72/07131
Means for applying material
Official title: {Means for applying material, e.g. for deposition or forming coatings}
H10W72/07131 (Means for applying material) appears on 345 US grants and 406 published applications in this corpus.
Search patents in H10W- Granted patents
- 345
- Published applications
- 406
- Assignees
- 136
- Inventors
- 696
- Latest grant
- 14 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2000 | 1 | 0 |
| 2001 | 2 | 2 |
| 2002 | 9 | 6 |
| 2003 | 2 | 8 |
| 2004 | 9 | 28 |
| 2005 | 6 | 23 |
| 2006 | 12 | 20 |
| 2007 | 17 | 24 |
| 2008 | 18 | 27 |
| 2009 | 21 | 45 |
| 2010 | 34 | 40 |
| 2011 | 25 | 32 |
| 2012 | 30 | 23 |
| 2013 | 23 | 20 |
| 2014 | 30 | 14 |
| 2015 | 25 | 17 |
| 2016 | 14 | 10 |
| 2017 | 6 | 7 |
| 2018 | 10 | 10 |
| 2019 | 10 | 6 |
| 2020 | 4 | 5 |
| 2021 | 4 | 14 |
| 2022 | 7 | 13 |
| 2023 | 9 | 4 |
| 2024 | 10 | 5 |
| 2025 | 5 | 3 |
| 2026 | 2 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Selective wire coating during wire bonding14 Jul 2026US 12,685,229 B2SanDisk Technologies LLC
- Bonding apparatus and bonding method using the same26 May 2026US 12,642,134 B2Samsung Display Co., Ltd.
- System and method for bonding semiconductor devices30 Sep 2025US 12,431,461 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor die dipping structure15 Jul 2025US 12,362,317 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Multi-functional shutter disk for thin film deposition chamber1 Jul 2025US 12,344,929 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Multi-functional shutter disk for thin film deposition chamber2 Oct 2025US 2025/0305115 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor Device and Method of Stacking and Interconnecting Semiconductor Assemblies Using Conductive Layer with Graphene Core Shells10 Jul 2025US 2025/0226345 A1STATS ChipPAC Pte. Ltd.
- System and methods for an embedded bridging package architecture19 Jun 2025US 2025/0201690 A1Samsung Electronics Co., Ltd.
- Selective wire coating during wire bonding26 Dec 2024US 2024/0429196 A1Western Digital Technologies, Inc.
- Chuck Design and Method for Wafer28 Nov 2024US 2024/0395595 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Manufacturing method of active matrix substrate, active matrix substrate and liquid crystal display device375US 6,127,199 ASeiko Epson Corporation · 2000
- Web process interconnect in electronic assemblies249US 6,468,638 B2Alien Technology Corporation · 2002
- Methods for fabricating a multiple modular assembly213US 6,316,278 B1Alien Technology Corporation · 2001
- Double-metal background driven displays210US 6,590,346 B1Alien Technology Corporation · 2003
- Light-emitting diode display and method for manufacturing the same173US 7,795,629 B2Sony Corporation · 2010