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US 2025/0201690 A1Published application
System and methods for an embedded bridging package architecture
AssigneeSamsung Electronics Co., Ltd.
InventorsJin YANG, Ramkumar SUBRAMANIAN, Sriram BALASUBRAMANIAN, Martin SCOTT
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Abstract
Disclosed herein are methods, systems and devices including a first layer with a first compute device, a first device stack, and a second device stack between the first device stack and the first compute device. A second layer may be mounted on top of the first layer. The second layer may include a first bridge electrically connecting the first compute device to the first device stack and a second bridge electrically connecting the first compute device to the second device stack.
Claims20
A device comprising:
- a first layer including a first compute device, a first device stack, and a second device stack between the first device stack and the first compute device;
- and
- a second layer, on top of the first layer, including a first bridge and a second bridge, wherein the first bridge electrically connects the first compute device to the first device stack and the second bridge electrically connects the first compute device to the second device stack.
A device comprising:
- a first layer including a first compute device, a first device stack, and a second device stack, wherein the second device stack is arranged between the first device stack and the first compute device;
- and
- a second layer including a first bridge, the first bridge to electrically connect the first compute device to the first device stack, and the first bridge to electrically connect the first compute device to the second device stack.
A method comprising:
- forming a bridging layer including a first bridge and a second bridge, and forming a first redistribution layer on a first side of bridging layer, the first redistribution layer communicatively coupled to the first bridge and the second bridge;
- mounting a compute device on the bridging layer and on the first redistribution layer;
- mounting a first device stack and a second device stack on the bridging layer and on the first redistribution layer, the second device stack is arranged between the first device stack and the compute device;
- depositing a dielectric layer over the bridging layer;
- coupling the first device stack to the compute device via the first bridge;
- and coupling the second device stack to the compute device via the second bridge.
3 more elements
Dependencies are inferred from the claim text.