Semiconductor die dipping structure
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChi-Chun Peng, Chih-Yuan Chiu, Min-Yu Wu, Yi-Kai Tu, Cheng-Lung Wu
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Abstract
A die dipping structure includes a plate including a first recessed portion having a first depth and filled with a first flux material. The plate further includes a second recessed portion, isolated from the first recessed portion, with a second depth and filled with a second flux material. The second depth is different from the first depth. The die dipping structure further includes a motor configured to move the plate so as to simultaneously dip a first die and a second die into the flux of the first recessed portion and the flux of the second recessed portion, respectively.
Claims20
A die dipping structure, comprising:
- a plate comprising:
- a first recessed portion having a first depth and being filled with a first flux material;
- and
- a second recessed portion, isolated from the first recessed portion, having a second depth and being filled with a second flux material, wherein the second depth is different from the first depth;
- and
- a motor configured to move the plate so as to simultaneously dip a first die and a second die into the flux of the first recessed portion and the flux of the second recessed portion, respectively.
A die dipping structure, comprising:
- an arm configured to hold a first die and a second die, wherein the first die has a first connector with a first height and the second die has a second connector with a second height;
- a plate comprising:
- a first recessed portion containing a first flux material, the first flux material having a third height;
- a second, discrete recessed portion containing a second flux material, the second flux material having a fourth height, wherein the first height and second height correspond to the third height and fourth height, respectively;
- and
- a motor configured to move the plate to align the first connector and second connector with the first recessed portion and the second recessed portion, respectively.
A method, comprising:
- providing a plate comprising a first recessed portion having a first depth and being filled with a first flux material, and a second recessed portion having a second depth and being filled with a second flux material, wherein the second depth is different from the first depth;
- and
- concurrently dipping a first die into the first recessed portion and dipping a second die into the second recessed portion, so as to coat a first connector of the first die and a second connector of the second die with the first flux material and second flux material, respectively.
Dependencies are inferred from the claim text.