Bonding apparatus and bonding method using the same

A bonding apparatus comprising:

• an ultrasonic oscillator which generates ultrasonic vibration;
• a stage disposed under the ultrasonic oscillator;
• and
• an embossed sheet disposed between the ultrasonic oscillator and the stage,
• wherein the embossed sheet includes:
• a body;
• and
• a plurality of protrusions protruding downward from a lower surface of the body which faces the stage, wherein the protrusions extend in a direction crossing an oscillating direction of an ultrasonic vibration of the ultrasonic oscillator,
• wherein the ultrasonic oscillator moves toward the stage, and the embossed sheet moves toward the stage by the ultrasonic oscillator to perform a bonding process, and
• the embossed sheet moves away from the stage after the bonding process is completed.