Double-metal background driven displays

An electronic assembly comprising:

• at least one object created and separated from a host substrate, said at least one object having a first electrical circuitry therein;
• a flexible receiving substrate having at least one recess, said flexible receiving substrate including said at least one recess being covered with a bottom conducting layer;
• wherein said at least one object couples to said flexible receiving substrate such that said at least one object being deposited on said bottom conducting layer and is recessed within said at least one recess of said flexible receiving substrate;
• and
• a top conducting layer to facilitate electrical interconnections from said at least one object is coupled to said flexible receiving substrate;
• wherein said bottom conducting layer is an optical reflector.

A display device comprising:

• an array of display drivers to drive pixel electrodes, each of said display drivers includes an electrical circuitry therein and is created and separated from a host substrate;
• a receiving substrate having an array of recesses, said receiving substrate including said recesses is covered with a bottom conducting layer;
• wherein each of said display drivers is coupled to said receiving substrate such that said display drivers are deposited on said bottom conducting layer and recessed within said each of said recesses;
• an insulation layer disposing over said receiving substrate such that said insulation layer insulates said bottom conducting layer and said display drivers;
• and
• a top conducting layer to facilitate electrical interconnections between said display drivers and said pixel electrodes is coupled to said receiving substrate.

An electronic assembly comprising:

• at least one object created and separated from a host substrate, said at least one object having a first electrical circuitry therein;
• a receiving substrate having at least one recess, said receiving substrate including said at least one recess being covered with a bottom conducting layer;
• wherein said at least one object is coupling to said receiving substrate such that said at least one object is deposited on said bottom conducting layer and recessed within said at least one recess of said receiving substrate;
• and
• a top conducting layer to facilitate electrical interconnections from said at least one object to said bottom conducting layer is coupled to said receiving substrate;
• wherein said bottom conducting layer is a non-patterned layer such that said bottom conducting layer being a shield that blocks interference to said at least one object.

An electronic assembly comprising:

• at least one object created and separated from a host substrate, said at least one object having a first electrical circuitry therein;
• a receiving substrate having at least one recess, said receiving substrate including said at least one recess being covered with a patterned bottom conducting layer is coupled to said at least one object such that said at least one object is deposited on said patterned bottom conducting layer and recessed within said at least one recess of said receiving substrate;
• and
• a patterned top conducting layer disposed over said receiving substrate such that said patterned top conducting layer and said patterned bottom conducting layer sandwich said at least one object therebetween,
• wherein said patterned top conducting layer facilitates a first level of electrical interconnections and wherein said patterned bottom conducting layer facilitates a second level of electrical interconnections.

A method of making an electronic assembly comprising:

• creating and separating at least one object from a host substrate, said at least one object having a first electrical circuitry therein;
• coupling a bottom conducting layer to a flexible receiving substrate having at least one recess such that said flexible receiving substrate including said at least one recess is coated with said bottom conducting layer;
• coupling said at least one object to said receiving substrate such that said at least one object is deposited on said bottom conducting layer and is recessed within said at least one recess of said receiving substrate;
• and
• coupling a top conducting layer to flexible substrate, said top conducting layer to facilitate electrical interconnections from said at least one object to said bottom conducting layer.

A method of making an electronic assembly comprising:

• creating and separating at least one object from a host substrate, said at least one object having a first electrical circuitry therein;
• coupling a with a bottom conducting layer to a flexible receiving substrate having at least one recess such that said flexible receiving substrate including said at least one recess is coated with said bottom conducting layer;
• coupling said at least one object to said flexible receiving substrate such that said at least one object is deposited on said bottom conducting layer and is recessed within said at least one recess of said flexible receiving substrate;
• and
• coupling a top conducting layer to said flexible receiving substrate such that said top conducting facilitates electrical interconnections from said at least one object;
• wherein said bottom conducting layer is an optical reflector.

A method of making a display device comprising:

• creating and separating an array of display drivers from a host substrate to drive pixel electrodes, each of said display drivers includes an electrical circuitry therein;
• coupling a bottom conducting layer to a receiving substrate having an array of recesses;
• coupling each of said display drivers to said receiving substrate such that said display drivers are deposited on said bottom conducting layer and recessed within said recesses;
• coating an insulation layer over said receiving substrate such that said insulation layer insulates said bottom conducting layer and said display drivers;
• coupling a top conducting layer to said receiving substrate, said top conducting layer facilitates electrical interconnections between said display drivers and said pixel electrodes.

A method of making an electronic assembly comprising:

• creating and separating at least one object from a host substrate, said at least one object having a first electrical circuitry therein;
• coupling a bottom conducting layer to a receiving substrate having at least one recess such that said receiving substrate including said at least one recess is covered with said bottom conducting layer;
• coupling said at least one object to said receiving substrate such that said at least one object is deposited on said bottom conducting layer and recessed within said at least one recess of said receiving substrate;
• and
• coupling a top conducting layer to said at least one object such that said top conducting layer facilitate electrical interconnections from said at least one object to said bottom conducting layer;
• wherein said bottom conducting layer is a non-patterned layer such that said bottom conducting layer acts as a shield that blocks interference to said at least one object.

A method of making an electronic assembly comprising:

• creating and separating at least one object from a host substrate, said at least one object having a first electrical circuitry therein;
• coupling a with a patterned bottom conducting layer to a receiving substrate having at least one recess such that said receiving substrate including said at least one recess is coated with said patterned bottom conducting layer;
• coupling said at least one object to said receiving substrate such that said at least one object is deposited on said patterned bottom conducting layer and is recessed within said at least one recess of said receiving substrate;
• and
• coupling a patterned top conducting layer to said receiving substrate such that said patterned top conducting layer and said patterned bottom conducting layer sandwich said at least one object therebetween;
• wherein said patterned top conducting layer facilitates a first level of electrical interconnections and said patterned bottom conducting layer facilitates a second level of electrical interconnections.

An electronic assembly comprising:

• at least one object created and separated from a host substrate, said at least one object having a first electrical circuitry therein;
• a receiving substrate having at least one recess, said receiving substrate including said at least one recess being covered with a bottom conducting layer;
• wherein said at least one object couples to said receiving substrate such that said at least one object is deposited on said bottom conducting layer and is recessed within said at least one recess of said receiving substrate;
• and
• a top conducting layer coupled to at least one of said one object and said bottom conducting layer.