H10W 72/07188
Apparatus chuck
Official title: {Apparatus chuck}
H10W72/07188 (Apparatus chuck) appears on 160 US grants and 211 published applications in this corpus.
Search patents in H10W- Granted patents
- 160
- Published applications
- 211
- Assignees
- 100
- Inventors
- 470
- Latest grant
- 28 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 1 |
| 2002 | 2 | 3 |
| 2003 | 2 | 1 |
| 2004 | 0 | 1 |
| 2005 | 2 | 2 |
| 2006 | 1 | 0 |
| 2007 | 0 | 1 |
| 2008 | 0 | 2 |
| 2009 | 2 | 2 |
| 2010 | 1 | 1 |
| 2011 | 1 | 8 |
| 2012 | 3 | 6 |
| 2013 | 4 | 8 |
| 2014 | 5 | 8 |
| 2015 | 9 | 8 |
| 2016 | 9 | 18 |
| 2017 | 15 | 19 |
| 2018 | 13 | 13 |
| 2019 | 14 | 14 |
| 2020 | 12 | 15 |
| 2021 | 13 | 15 |
| 2022 | 5 | 16 |
| 2023 | 14 | 12 |
| 2024 | 17 | 14 |
| 2025 | 10 | 8 |
| 2026 | 4 | 15 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Handling a fragile substrate for interconnect bonding28 Jul 2026US 12,696,783 B2Asmpt Singapore Pte. Ltd.
- Method of manufacturing a bonded substrate stack by surface activation19 May 2026US 12,635,548 B2Infineon Technologies AG
- Compliant locating structure for a bond head assembly13 Jan 2026US 12,525,571 B1Asmpt Singapore Pte. Ltd.
- Solder reflow apparatus and method of manufacturing an electronic device6 Jan 2026US 12,519,077 B2Samsung Electronics Co., Ltd.
- Die bonding tool with tiltable bond head for improved bonding and methods for performing the same23 Dec 2025US 12,506,109 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Joining correction method24 Sep 2026US 2026/0284795 A1Tazmo Co., Ltd.
- Apparatus for manufacturing micro led display16 Jul 2026US 2026/0206630 A1LG Electronics Inc.
- Device for holding a substrate and a method and apparatus for forming an electronic module9 Jul 2026US 2026/0198359 A1JCET STATS ChipPAC Korea Limited
- Micro-controlled environment carrier with pedestals2 Jul 2026US 2026/0183840 A1Boschman Technologies B.V.
- Laser-assisted reflow for selective heating used with a low temperature tray2 Jul 2026US 2026/0191068 A1Intel Corporation
Most cited
By later US patents
- Mass transfer tool manipulator assembly98US 9,308,649 B2LuxVue Techonology Corporation · 2016
- Method and device for thermally bonding connecting surfaces of two substrates26US 6,394,158 B1Pac Tech—Packaging Technologies GmbH · 2002
- Methods for flip chip stacking19US 8,618,648 B1Xilinx, Inc. · 2013
- Method for solder-bonding contact pad arrays17US 5,667,132 ALucent Technologies Inc. · 1997
- Individual chip joining machine15US 4,160,893 AInternational Business Machines Corporation · 1979