Die bonding tool with tiltable bond head for improved bonding and methods for performing the same

A method of bonding a semiconductor die to a substrate, comprising:

• securing the semiconductor die to a planar surface of a bond head;
• moving the bond head and the semiconductor die towards the substrate;
• detecting an initial contact between the semiconductor die and the substrate;
• tilting the planar surface of the bond head and the semiconductor die about at least one tilt axis in response to detecting the initial contact between the semiconductor die and the target substrate;
• and
• stopping the tilting of the planar surface of the bond head and the semiconductor die in response to determining that a contact criterion between the semiconductor die and the target substrate is met.

A method of bonding a semiconductor die to a target substrate using a die bonding tool, comprising:

• aligning a semiconductor die secured to a lower surface of the die bonding tool over an upper surface of the target substrate such that one or more first bonding features on the semiconductor die are aligned with one or more second bonding features on the target substrate;
• controlling the die bonding tool to move semiconductor substrate towards the target substrate;
• detecting, at a first contact sensor located in a first region of die bonding tool, contact between one or more first bonding features located in the first region of the semiconductor die and one or more second bonding features on the target substrate;
• controlling the die bonding tool to tilt the semiconductor die with respect to the target substrate;
• detecting, at a second contact sensor located in a second region of die bonding tool, contact between one or more first bonding features located in a second region of the semiconductor die and one or more second bonding features on the target substrate;
• and
• applying a compressive force to the semiconductor die along a direction normal to the lower surface of the die bonding tool in response to detecting the contact between one or more first bonding features located in the second region of the semiconductor die and the one or more second bonding features on the target substrate.