Method of manufacturing a bonded substrate stack by surface activation
AssigneeInfineon Technologies AG
InventorsAlfred Sigl, Alexander Frey
Life of this patent
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Abstract
A method of manufacturing a bonded substrate stack includes: providing a first substrate having a first hybrid interface layer, the first hybrid interface layer including a first insulator and a first metal; providing a second substrate having a second hybrid interface layer, the second hybrid interface layer including a second insulator and a second metal; surface-activating the first hybrid interface layer and the second hybrid interface layer by particle bombardment; and bringing the surface-activated first hybrid interface layer and the surface-activated second hybrid interface layer into contact, such that the first and second insulators bond together and the first and second metals bond together at the same time.
Claims20
A method of manufacturing a bonded substrate stack, the method comprising:
- providing a first substrate having a first hybrid interface layer, the first hybrid interface layer comprising a first insulator and a first metal;
- providing a second substrate having a second hybrid interface layer, the second hybrid interface layer comprising a second insulator and a second metal;
- surface-activating the first hybrid interface layer and the second hybrid interface layer by particle bombardment;
- and
- bringing the surface-activated first hybrid interface layer and the surface-activated second hybrid interface layer into contact, such that the first and second insulators bond together and the first and second metals bond together at the same time.
A substrate stack, comprising:
- a first substrate having a first hybrid interface layer, the first hybrid interface layer comprising a first insulator and a first metal;
- and
- a second substrate having a second hybrid interface layer, the second hybrid interface layer comprising a second insulator and a second metal,
- wherein the first hybrid interface layer is bonded to the second hybrid interface layer,
- wherein the first and second insulators are bonded together by surface-activated bonds,
- wherein the first and second metals are bonded together by surface-activated bonds.
Dependencies are inferred from the claim text.