Device for holding a substrate and a method and apparatus for forming an electronic module

A device for holding a substrate, the device comprising:

• a lower jig comprising a jig base for placing a substrate, wherein the substrate has at least one electronic component each being mounted thereon via a solder paste, and the jig base is transparent to laser radiation;
• and
• an upper jig operably mounted on the lower jig, and defining together with the lower jig a cavity for accommodating the substrate, wherein the upper jig comprises a frame and a rib inside the frame, and the frame and the rib form a grid pattern defining a plurality of openings for exposing the at least one electronic component from the upper jig, and wherein when the upper jig is mounted on the lower jig to accommodate the substrate inside the cavity and the solder paste is reflowed by the laser radiation, the grid pattern is in contact with the substrate to apply a force to press the substrate against the lower jig.