Compliant locating structure for a bond head assembly

A die bonding system comprising:

• a bonding station for holding a substrate to which a die is to be bonded, and
• a bond head assembly for bonding the die to the substrate, the bond head assembly comprising:
• a collet operative to hold the die during a bonding process, and
• a planar compliant locating structure having a plane, the complaint locating structure including a first flexural element that is positioned to contact a first side surface of the collet and a second flexural element that is positioned to contact a second side surface of the collet, the first and second side surfaces of the collet being substantially orthogonal to each other,
• wherein each of the first and second flexural elements is arranged such that a portion thereof is deflectable by movement of the collet against the flexural element, thereby causing the first or second flexural element to exert a biasing force against the first or second side surface of the collet along the plane of the compliant locating structure to restrict positional shifts of the collet towards the flexural element.