Solder reflow apparatus and method of manufacturing an electronic device
AssigneeSamsung Electronics Co., Ltd.
InventorYoungja Kim
Life of this patent
Estimating the term…
Abstract
A method of manufacturing an electronic device includes: providing a vapor generating chamber that accommodates a heat transfer fluid; providing a substrate stage within the vapor generating chamber, the substrate stage including a seating surface and suction passages penetrating the substrate stage to be open to the seating surface; loading a substrate on the substrate stage, wherein electronic components are disposed on the substrate via bumps; generating at least a partial vacuum in the suction holes to suction-support the substrate on the seating surface; heating the heat transfer fluid to generate saturated vapor within the vapor generating chamber; and soldering the bumps using the saturated vapor.
Claims20
A method of manufacturing an electronic device, the method comprising:
- providing a vapor generating chamber that accommodates a heat transfer fluid;
- providing a substrate stage within the vapor generating chamber, the substrate stage comprising a seating surface and suction passages penetrating the substrate stage to be open to the seating surface;
- loading a substrate on the substrate stage, wherein electronic components are disposed on the substrate via bumps;
- generating at least a partial vacuum in the suction passages to suction-support the substrate on the seating surface;
- heating the heat transfer fluid to generate saturated vapor within the vapor generating chamber;
- and
- soldering the bumps using the saturated vapor.
A method of manufacturing an electronic device, the method comprising:
- disposing electronic components on a substrate via bumps;
- loading the substrate on a substrate stage within a vapor generating chamber that accommodates a heat transfer fluid, the substrate stage comprising a seating surface and suction passages penetrating the substrate stage to be open to the seating surface;
- generating at least a partial vacuum in the suction passages to suction-support the substrate on the seating surface;
- heating the heat transfer fluid to generate saturated vapor within the vapor generating chamber;
- moving the substrate stage downward and upward within the vapor generating chamber;
- and
- soldering the bumps using the saturated vapor.
A method of manufacturing an electronic device, the method comprising:
- providing a substrate stage within a vapor generating chamber that accommodates a heat transfer fluid and is configured to be movable upward and downward within the vapor generating chamber, the substrate stage comprising:
- a seating surface;
- suction passages penetrating the substrate stage to be open to the seating surface;
- and vapor passages penetrating the substrate stage;
- loading a substrate on the substrate stage, wherein electronic components are disposed on the substrate via bumps;
- generating at least a partial vacuum in the suction passages to suction-support the substrate on the seating surface;
- heating the heat transfer fluid to generate saturated vapor within the vapor generating chamber;
- monitoring a temperature gradient along a vertical direction within the vapor generating chamber to determine a height to which the substrate is moved;
- supplying at least a portion of the saturated vapor through the vapor passages such that the at least the portion of the saturated vapor is brought into contact with a lower surface of the substrate;
- and
- soldering the bumps using the saturated vapor.
Dependencies are inferred from the claim text.