Method and device for thermally bonding connecting surfaces of two substrates
AssigneePac Tech—Packaging Technologies GmbH
InventorKaveh Momeni
Life of this patent
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Abstract
A method for the thermal connection of overlapping connecting surfaces (19, 20) of two substrates (17, 18), at least one substrate (18) being 5 transparent and laser energy being applied to the connecting surfaces (19, 20) from a rear side (26) of the transparent substrate (18), laser energy being applied separately to each of the contact pairs (37) constructed between two connecting surfaces (19, 20) of the opposing substrates (17, 18).
Claims10
A method for the thermal connection of overlapping connecting surfaces of two opposing substrates with contact pairs between the connecting surfaces of the opposing substrates, the method comprising the steps of:
- providing one of the two substrates as a transparent substrate, the transparent substrate being transparent to laser energy;
- applying laser energy from a laser emitting device to the connecting surfaces from a rear side of the transparent substrate by angular movements of a swivel mirror device
- applying laser energy from the laser emitting device separately to each of the contact pairs by angular movements of the swivel mirror device;
- axially displacing a focusing device in a beam path between the laser emitting device and the contact pairs as a function of the angular movements of the swivel mirror device;
- and
- pressing connecting surfaces of the substrates against one another with a pressing device acting upon one of the substrates, the pressing device including a transparent force introduction device and a transparent non compressible deformable volume forming a pressure cushion simulating fluid pressure, the deformable volume being arranged between the transparent force introduction device and a rear side of one of the substrates.
A device for manufacturing a thermal connection of overlapping connecting surfaces of two substrates, one substrate being a transparent substrate, and laser energy being applied to the connecting surfaces from a rear side of the transparent substrate, the device comprising:
- a laser emitting device for emitting radiation energy in the form of a laser beam;
- a radiation transmitting device for transmitting the radiation energy from the laser emitting device to a contact pair of the connecting surfaces, the radiation transmitting device comprising a first swivel mirror device and a second swivel mirror device for generating a beam path from the laser emitting device to the contact pair, the beam path being deflected by the first swivel mirror device and the beam path being deflected by the second swivel mirror device and a focusing device, which is axially displaceable in the beam path, is arranged in a beam path between said laser emitting device and the contact pair;
- and
- a pressing device acting upon the transparent substrate with at least one transparent force introduction device, the transparent force introduction device being provided with a transparent non compressible deformable volume, providing a pressure cushion for the application of pressure, simulating fluid pressure, in a contact region of a rear side of the one of the substrates.
Dependencies are inferred from the claim text.