Laser-assisted reflow for selective heating used with a low temperature tray

Abstract

A system for solder processing a semiconductor device can be performed with LAR (laser assisted reflow) with a low temperature matrix tray. The system includes a tray shield to shield the matrix tray from excessive heat exposure during solder reflow. The shielding prevents heat exposure past the point of warpage during reflow due to heat exposure from laser light. The LAR has a laser source that provides collimated laser light to induce solder reflow in the target semiconductor device.

Dependencies are inferred from the claim text.