H10W 72/07139
Means for protection against electrical discharge
Official title: {Means for protection against electrical discharge}
H10W72/07139 (Means for protection against electrical discharge) appears on 6 US grants and 7 published applications in this corpus.
Search patents in H10W- Granted patents
- 6
- Published applications
- 7
- Assignees
- 6
- Inventors
- 20
- Latest grant
- 20 Aug 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2015 | 0 | 2 |
| 2016 | 1 | 0 |
| 2017 | 0 | 1 |
| 2018 | 3 | 0 |
| 2019 | 0 | 2 |
| 2020 | 0 | 1 |
| 2021 | 1 | 0 |
| 2022 | 0 | 0 |
| 2023 | 0 | 1 |
| 2024 | 1 | 0 |
By publication year.
Recent patents
- Chip transfer apparatus20 Aug 2024US 12,068,178 B2Samsung Electronics Co., Ltd.
- Wire bonding apparatus, circuit for wire bonding apparatus, and method for manufacturing semiconductor device30 Mar 2021US 10,964,661 B2Kabushiki Kaisha Shinkawa
- Removal of electrostatic charges from an interposer via a ground pad thereof for die attach for formation of a stacked die3 Jul 2018US 10,015,916 B1Xilinx, Inc.
- Removal of electrostatic charges from interposer for die attachment1 May 2018US 9,960,227 B2Xilinx, Inc.
- Electrostatic discharge protection apparatus and process10 Apr 2018US 9,941,239 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Chip transfer apparatus18 May 2023US 2023/0154769 A1Samsung Electronics Co., Ltd.
- Wire bonding device, circuit for wire bonding device, and method for manufacturing semiconductor device17 Sep 2020US 2020/0294957 A1Kabushiki Kaisha Shinkawa
- Method for Bonding an Electrically Conductive Element to a Bonding Partner21 Nov 2019US 2019/0356098 A1Infineon Technologies AG
- Methods for wire bonding and testing and flash memories fabricated by the same10 Jan 2019US 2019/0013292 A1Silicon Motion, Inc.
- Electrostatic discharge protection apparatus and process23 Feb 2017US 2017/0053890 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Removal of electrostatic charges from an interposer via a ground pad thereof for die attach for formation of a stacked die51US 10,015,916 B1Xilinx, Inc. · 2018
- Chip transfer apparatus2US 12,068,178 B2Samsung Electronics Co., Ltd. · 2024
- Electrostatic discharge protection apparatus and process1US 9,491,840 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Electrostatic discharge protection apparatus and process1US 9,941,239 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2018