Chip transfer apparatus
AssigneeSamsung Electronics Co., Ltd.
InventorsDongkyun Kim, Hyunjoon Kim, Joonyong Park, Seogwoo Hong, Kyungwook Hwang
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Abstract
A chip transfer apparatus includes: a chip storage module in which a plurality of micro-semiconductor chips and a suspension including impurities are stored; a chip filtration module separating a first suspension including the plurality of micro-semiconductor chips and a second suspension including the impurities in the suspension; and a chip supply module configured to supply the first suspension onto the transfer substrate such that the first suspension is introduced from the chip filtration module and the plurality of micro-semiconductor chips are flowable on the transfer substrate.
Claims24
A chip transfer apparatus configured to align a plurality of micro-semiconductor chips in a plurality of grooves of a transfer substrate, the chip transfer apparatus comprising:
- a chip storage module configured to store a suspension including the plurality of micro-semiconductor chips and impurities;
- a chip filtration module configured to receive the suspension from the chip storage module and separate a first suspension including the plurality of micro-semiconductor chips and a second suspension including the impurities;
- and
- a chip supply module configured to supply the first suspension onto the transfer substrate from the chip filtration module, wherein the plurality of micro-semiconductor chips included in the first suspension are flowable on the transfer substrate,
- wherein the chip filtration module comprises:
- an inlet connected to a lower area of the chip storage module, the inlet configured to receive the suspension introduced from the chip storage module;
- a channel connected to the inlet and through which the suspension flows;
- and
- a first outlet connected to the channel and an upper area of the chip supply module and configured to discharge the first suspension to the chip supply module.
A chip filtration apparatus comprising:
- an inlet configured to receive a first suspension including a plurality of micro-semiconductor chips and a plurality of impurities;
- a first channel configured to transport the first suspension from the inlet to a junction at which the first suspension is separated into a second suspension including the plurality of micro-semiconductor chips and a third suspension including the plurality of impurities;
- a second channel connected to the junction and configured to transport the second suspension including the plurality of micro-semiconductor chips;
- a third channel connected to the junction and configured to transport the third suspension including the plurality of impurities;
- a first outlet connected to the second channel and configured to receive the second suspension including the plurality of micro-semiconductor chips;
- and
- a second outlet connected to the third channel and configured to receive the third suspension including the plurality of impurities.
Dependencies are inferred from the claim text.