Wire bonding apparatus, circuit for wire bonding apparatus, and method for manufacturing semiconductor device

A circuit for a wire bonding apparatus comprising:

• a high-voltage power supply circuit that supplies power to a torch electrode forming a free air ball at a front end of a wire by electrical discharges;
• a non-bonding detection circuit that performs non-bonding detection between the wire and a device or the wire and a substrate;
• a first changeover switch that switches a connection between a spool from which the wire extends and the high-voltage power supply circuit or the spool and the non-bonding detection circuit;
• a relay that turns on/off a connection between a clamper gripping the wire extended from the spool and the spool side of the first changeover switch;
• and
• a control part that sets the first changeover switch to the high-voltage power supply circuit side and turns off the relay to generate the electrical discharges, and sets the first changeover switch to the non-bonding detection circuit side and turns on the relay to perform the non-bonding detection.

A method of manufacturing a semiconductor device comprising processes as follows:

• preparing a wire bonding apparatus including:
• a spool;
• a clamper that grips a wire extended from the spool;
• a torch electrode that forms a free air ball at a front end of the wire by electrical discharges;
• a high-voltage power supply circuit that supplies power to the torch electrode;
• a non-bonding detection circuit that performs non-bonding detection between the wire and a device or the wire and a substrate;
• a first changeover switch that switches a connection between the spool and the high-voltage power supply circuit or the spool and the non-bonding detection circuit;
• and a relay that turns on/off a connection between the clamper and the spool side of the first changeover switch;
• forming the free air ball by setting the first changeover switch to the high-voltage power supply circuit side and turning off the relay, and causing the high-voltage power supply circuit to supply power to the torch electrode;
• bonding the wire in which the free air ball is formed to a device or a substrate;
• and
• performing the non-bonding detection between the wire and the device or the wire and the substrate by setting the first changeover switch to the non-bonding detection circuit side and turning on the relay.