Removal of electrostatic charges from an interposer via a ground pad thereof for die attach for formation of a stacked die

A method, comprising:

• loading a passive interposer having a plurality of conductors for coupling two or more integrated circuit dies to the interposer to provide a stacked die and one or more microbumps extending from one or more microbump pads;
• grounding the interposer with a grounded probe;
• wherein the grounded probe is put in mechanical contact with an exposed conductive pad on the interposer, the exposed conductive pad coupled to a conductive network of the interposer configured for the grounding thereof to dissipate electrostatic charge from the interposer prior to the two or more integrated circuit dies being coupled to the interposer, the exposed conductive pad disposed outward and clear of areas of the interposer configured to receive the two or more integrated circuit dies, wherein the exposed conductive pad has a larger plan area than each of the one or more microbump pads;
• and
• coupling the two or more integrated circuit dies to the interposer via the microbumps extending from the microbump pads of the two or more integrated circuit dies while grounded via the grounded probe to provide the stacked die, wherein the exposed conductive pad has a larger plan area than each of the microbump pads.