Methods for wire bonding and testing and flash memories fabricated by the same
AssigneeSilicon Motion, Inc.
InventorsShu-Ying HUANG, Te-Wei CHEN, Hsiu-Yuan CHEN
Life of this patent
Estimating the term…
Abstract
The invention introduces a method for wire bonding and testing, performed by wire-bonding equipment, including at least the following steps: providing a substrate and dies, where the substrate has exposed fingers and each die has exposed pads; controlling a motor to hold the substrate by a metal frame, where all the exposed fingers are floating from the metal frame to avoid ESD (electrostatic discharge) fail; and performing a wire bonding to make interconnections between the pads on the dies and the fingers on the substrate to fabricate a semi-finished flash-memory product.
Claims11
A method for wire bonding and testing, performed by wire-bonding equipment, comprising:
- providing a substrate and a plurality of dies, wherein the substrate comprises a plurality of exposed fingers and each die comprises a plurality of exposed pads;
- controlling a motor to hold the substrate by a metal frame, wherein all the exposed fingers are floating from the metal frame to avoid ESD (electrostatic discharge) fail;
- and
- performing a wire bonding to make interconnections between the pads on the dies and the fingers on the substrate to fabricate a semi-finished flash-memory product.
A flash memory, comprising:
- a substrate, comprising a plurality of exposed fingers, in which no metal line is formed to connect one of the exposed fingers to an edge of the substrate to avoid ESD (electrostatic discharge) fail when a wire bonding is performed;
- a first die, disposed on the substrate, wherein the first die comprises ICs (Integrated Circuits) of a controller, and a plurality of exposed pads;
- and
- a plurality of second dies, disposed on the substrate, wherein each second die comprises ICs of a storage sub-unit, and a plurality of exposed pads.
Dependencies are inferred from the claim text.