H10W 72/07183
Means for monitoring
Official title: {Means for monitoring}
H10W72/07183 (Means for monitoring) appears on 552 US grants and 607 published applications in this corpus.
Search patents in H10W- Granted patents
- 552
- Published applications
- 607
- Assignees
- 207
- Inventors
- 1,214
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 2 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 0 | 0 |
| 1986 | 2 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 5 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 2 | 0 |
| 1993 | 0 | 0 |
| 1994 | 3 | 0 |
| 1995 | 2 | 0 |
| 1996 | 4 | 0 |
| 1997 | 3 | 0 |
| 1998 | 0 | 0 |
| 1999 | 10 | 0 |
| 2000 | 8 | 0 |
| 2001 | 5 | 0 |
| 2002 | 6 | 4 |
| 2003 | 4 | 6 |
| 2004 | 5 | 4 |
| 2005 | 4 | 7 |
| 2006 | 4 | 4 |
| 2007 | 4 | 6 |
| 2008 | 8 | 9 |
| 2009 | 7 | 5 |
| 2010 | 6 | 7 |
| 2011 | 6 | 12 |
| 2012 | 7 | 11 |
| 2013 | 7 | 21 |
| 2014 | 14 | 27 |
| 2015 | 17 | 40 |
| 2016 | 30 | 35 |
| 2017 | 30 | 42 |
| 2018 | 29 | 45 |
| 2019 | 42 | 33 |
| 2020 | 38 | 70 |
| 2021 | 42 | 54 |
| 2022 | 47 | 58 |
| 2023 | 49 | 34 |
| 2024 | 42 | 26 |
| 2025 | 35 | 23 |
| 2026 | 19 | 24 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Wire bonding apparatus and control method8 Sep 2026US 12,728,478 B2Kioxia Corporation
- Apparatus for bonding clip, method of bonding clip, and semiconductor package including semiconductor chip to which clip is bonded using the method8 Sep 2026US 12,733,527 B2JMJ Korea Co., Ltd.
- Pick and place method with detecting an event18 Aug 2026US 12,713,956 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Soldering device including pulsed light irradiator, soldering method using pulsed light irradiation, and method of manufacturing semiconductor package11 Aug 2026US 12,703,044 B2Samsung Electronics Co., Ltd.
- Bonding apparatus, bonding method, and computer readable storage medium4 Aug 2026US 12,702,037 B2Yamaha Robotics Co., Ltd.
- Reflow method and system17 Sep 2026US 2026/0273640 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Post-plasma clean infrared image inspection for oxideless bonding and apparatus for effecting the same17 Sep 2026US 2026/0278765 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Methods of cutting a wire on a wire bonding system, and related cutting blades and wire bonding systems10 Sep 2026US 2026/0264165 A1Kulicke and Soffa Industries, Inc.
- Automatic wire threading method and system27 Aug 2026US 2026/0250097 A1Asmpt Singapore Pte. Ltd.
- Method and apparatus for determining a positioning error of a pickable component27 Aug 2026US 2026/0255919 A1
Most cited
By later US patents
- Optical systems fabricated by printing-based assembly564US 7,972,875 B2The Board of Trustees of the University of Illinois · 2011
- Optical systems fabricated by printing-based assembly346US 8,722,458 B2Semprius, Inc. · 2014
- Method of making slack free wire interconnections140US 4,327,860 AKulicke and Soffa Ind. Inc. · 1982
- Adaptive lithography system to provide high density interconnect138US 4,835,704 AGeneral Electric Company · 1989
- Method of making fine wire interconnections129US 4,437,604 AKulicke and Soffa Industries, Inc. · 1984