Bonding apparatus, bonding method, and computer readable storage medium

A bonding method using a bonding apparatus comprising:

• a head part provided in a drivable manner with respect to a substrate mounted on a stage;
• a bonding tool which is provided at the head part and supplies a bonding wire to bonding points of the substrate;
• and
• a first imaging unit and a second imaging unit provided at the head part, each of the first imaging unit and the second imaging unit comprising an optical system and an imaging element arranged to satisfy a Scheimpflug condition such that a plane parallel to a stage surface of the stage becomes a focal plane, the first imaging unit and the second imaging unit being capable of focusing a tip of the bonding wire extended from the bonding tool, and being configured to simultaneously capture a first image and a second image,
• the bonding method comprising:
• an imaging step of causing each of the first imaging unit and the second imaging unit to simultaneously image a target point to which the bonding wire is to be supplied next among the bonding points of the substrate fixed on the stage;
• a calculation step of calculating three-dimensional coordinates of the target point based on a first picture which is a picture of the target point captured in the first image outputted by the first imaging unit, and a second picture which is a picture of the target point captured in the second image outputted by the second imaging unit, and calculating three-dimensional coordinates of a subsequent point to which the bonding wire is to be supplied subsequently among the bonding points, based on a third picture which is a picture of the subsequent point captured in the first image, and a fourth picture which is a picture of the subsequent point captured in the second image;
• and
• a driving step of causing the bonding tool which supplies the bonding wire to approach the target point based on the three-dimensional coordinates of the target point, and
• moving, after supply of the bonding wire to the target point, the bonding tool based on the three-dimensional coordinates of the subsequent point.

A computer readable storage medium storing a bonding program which controls a bonding apparatus comprising:

• a head part provided in a drivable manner with respect to a substrate mounted on a stage;
• a bonding tool which is provided at the head part and supplies a bonding wire to bonding points of the substrate;
• and
• a first imaging unit and a second imaging unit provided at the head part, each of the first imaging unit and the second imaging unit comprising an optical system and an imaging element arranged to satisfy a Scheimpflug condition such that a plane parallel to a stage surface of the stage becomes a focal plane, the first imaging unit and the second imaging unit being capable of focusing a tip of the bonding wire extended from the bonding tool, and being configured to simultaneously capture a first image and a second image,
• the bonding program causing a computer to execute:
• an imaging step of causing each of the first imaging unit and the second imaging unit to image a target point to which the bonding wire is to be supplied next among the bonding points of the substrate fixed on the stage;
• a calculation step of calculating three-dimensional coordinates of the target point based on a first picture which is a picture of the target point captured in the first image outputted by the first imaging unit, and a second picture which is a picture of the target point captured in the second image outputted by the second imaging unit, and calculating three-dimensional coordinates of a subsequent point to which the bonding wire is to be supplied subsequently among the bonding points, based on a third picture which is a picture of the subsequent point captured in the first image, and a fourth picture which is a picture of the subsequent point captured in the second image;
• and
• a driving step of causing the bonding tool which supplies the bonding wire to approach the target point based on the three-dimensional coordinates of the target point, and
• moving, after supply of the bonding wire to the target point, the bonding tool based on the three-dimensional coordinates of the subsequent point.