Methods of cutting a wire on a wire bonding system, and related cutting blades and wire bonding systems
AssigneeKulicke and Soffa Industries, Inc.
InventorsTao Xu, Jose de Jesus Lozano De Alva, Robert Ito, Frank Daniels, JR., Yahia Benhacene, Stanley Tang
Life of this patent
Estimating the term…
Abstract
A wire bonding system is provided herein. The wire bonding system includes a bonding tool. The wire bonding system also includes a cutting blade disposed adjacent to the bonding tool. The cutting blade defines a face on a side of the cutting blade adjacent a tip of the cutting blade. The face is configured to contact wire prior to a cutting operation.
Claims44
A wire bonding system comprising:
- a bonding tool;
- and
- a cutting blade disposed adjacent to the bonding tool, the cutting blade defining a face on a side of the cutting blade adjacent a tip of the cutting blade, the face configured to contact wire prior to a cutting operation.
A wire bonding system comprising:
- a bonding tool;
- and
- a cutting blade disposed adjacent to the bonding tool, the cutting blade defining a first side and a second side, the first side facing the bonding tool, the second side being opposite the first side, the second side defining a first flat portion adjacent a tip of the cutting blade and a second flat portion adjacent the first flat portion, the first flat portion and the second flat portion meeting at an area of intersection, the first flat portion and the second flat portion being non-parallel to each other, wherein the area of intersection is configured to contact wire prior to a cutting operation.
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A method of cutting a wire in connection with a wire bonding system comprising the steps of:
- (a) providing a bonding tool;
- (b) providing a cutting blade adjacent the bonding tool;
- (c) moving the cutting blade to contact a portion of the wire;
- and
- (d) cutting another portion of the wire away from the portion of the wire.
Dependencies are inferred from the claim text.