Wire bonding apparatus and control method
AssigneesKabushiki Kaisha Toshiba, Kioxia Corporation
InventorsMasatoshi Tanabe, Takashi Ito, Takahiro Aizawa, Akira Tojo, Yasunari Ukita
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Abstract
According to one embodiment, a controller of a wire bonding apparatus is configured to calculate a height of a bump based on a diameter of a ball-shaped portion detected by a diameter detecting part, a first position of a bonding tool detected by a position detecting part when a load sensor detects a load at a first bonding point, and a second position of the bonding tool when the bonding tool is lowered at the first bonding point, and to bond a wire based on the calculated height of the bump.
Claims14
A wire bonding apparatus configured to bond a wire to a first bonding point and to a second bonding point by generating an ultrasonic vibration in a state in which the wire is pressed onto the first bonding point and by generating an ultrasonic vibration in a state in which the wire is pressed onto the second bonding point, the apparatus comprising:
- a bonding tool;
- an ultrasonic horn configured to generate an ultrasonic vibration;
- a load sensor configured to detect a load applied from the bonding tool to the first bonding point or to the second bonding point;
- a position detecting part configured to detect a position in a vertical direction of the bonding tool;
- a diameter detecting part configured to detect a diameter of a ball-shaped portion formed at a tip of the bonding tool at the first bonding point;
- and
- a controller configured to calculate a height of a bump based on
- the diameter of the ball-shaped portion detected by the diameter detecting part,
- a first position of the bonding tool detected by the position detecting part when the load sensor detects a load at the first bonding point, and
- a second position of the bonding tool when the bonding tool is lowered most at the first bonding point,
- the controller being configured to bond the wire based on the calculated height of the bump.
A control method of a wire bonding apparatus, the apparatus being configured to bond a wire to a first bonding point and to a second bonding point by generating an ultrasonic vibration in a state in which the wire is pressed onto the first bonding point and by generating an ultrasonic vibration in a state in which the wire is pressed onto the second bonding point, the method comprising:
- detecting a diameter of a ball-shaped portion formed at a tip of a bonding tool at the first bonding point;
- acquiring a first position in a vertical direction of the bonding tool at the first bonding point when a load applied from the bonding tool to the first bonding point is detected;
- acquiring a second position of the bonding tool when the bonding tool is lowered most at the first bonding point;
- calculating a height of a bump based on the diameter of the ball-shaped portion, the first position, and the second position;
- and
- bonding the wire based on the calculated height of the bump.
Dependencies are inferred from the claim text.