US 4,437,604 AGranted

Method of making fine wire interconnections

AssigneeKulicke and Soffa Industries, Inc.

InventorsEly Razon, Dan Vilenski

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Abstract

The present invention teaches a novel method of making ultrasonic fine wire interconnections between pads on a semiconductor chip and lead out terminals which may be performed with commercially available computer controlled automatic wire bonding machines having an ultrasonic bonding tool holder. A capillary wedge bonding tool is employed which has an annular working face similar in cross-section to a conventional narrow face bonding wedge. When the second bond of an interconnecting wire is made, the capillary wedge bonding tool is moved away from the second bond to leave a small portion of the wire exposed out of the capillary wedge bonding tool. The wire is clamped and the bonding tool is then moved in a predetermined direction away from the second bond to break the wire and form a wire bonding tail. The predetermined direction of movement is at an angle which properly aligns the wire bonding tail in an angular direction under the annular working face of the capillary wedge bonding tool without the necessity of rotating the wedge bonding tool relative to the semiconductor chip.

Claims4

Dependent claims

A method of making uniform fine wire interconnections between conductive pads on a semiconductor device and conductive terminals on a substrate employing a capillary type bonding tool comprising:

providing a fine wire in the capillary wedge bonding tool of the type having an annular working face with the end of the fine wire bent under the working face,
making a first wire bond to attach said bent end of said fine wire to a first conductive pad on said semiconductor,
moving said bonding tool away from said first conductive pad while paying out said fine wire to make a first fine wire loop interconnection between said first conductive pad and a first conductive terminal,
clamping said fine wire relative to said bonding tool,
making a second wire bond by attaching said fine wire to said first conductive terminal to provide a first fine wire interconnection between said conductive pad and said conductive terminal.
determining the angular direction of said first fine wire interconnection,
releasing said clamped fine wire,
moving said capillary wedge bonding tool a short vertical and horizontal distance from said second bond to pay out a bent end of fine wire under the working face of said capillary wedge bonding tool,
clamping said fine wire to prevent relative movement of said fine wire in said capillary bonding tool,
determining the angular direction between the next conductive pad on said semiconductor device and the next conductive terminal on said substrate to be interconnected by said fine wire, and wherein the included angle between said first wire interconnection and said second fine wire interconnection is between 15 degrees and 60 degrees, and
moving said capillary wedge bonding tool substantially horizontally away from said first and said second wire bonds along a path which is substantially equal to the determined angular direction between said next conductive pad and said next conductive terminal on said substrate to be interconnected by said fine wire to provide the end of said fine wire bent under said capillary bonding tool oriented in a proper angle direction for the next first wire bond on said next conductive pad.

8 more elements

A method of making uniform fine wire interconnections between conductive pads on a semiconductor device and conductive terminals on a substrate employing a capillary type bonding tool comprising:

providing a fine wire in the capillary wedge bonding tool of the type having an annular working face with the end of the fine wire bent under the working face,
making a first wire bond to attach said bent end of said fine wire to a first conductive pad on said semiconductor,
moving said bonding tool away from said first conductive pad while paying out said fine wire to make a first fine wire loop interconnection between said first conductive pad and a first conductive terminal,
clamping said fine wire relative to said bonding tool,
making a second wire bond by attaching said fine wire to said first conductive terminal to provide a first fine wire interconnection between said conductive pad and said conductive terminal,
determining the angular direction of said first fine wire interconnection,
releasing said clamped fine wire,
moving said capillary wedge bonding tool a short vertical and horizontal distance from said second bond to pay out a bent end of fine wire under the working face of said capillary wedge bonding tool,
clamping said fine wire to prevent relative movement of said fine wire in said capillary bonding tool,
determining the angular direction between the next conductive pad on said semiconductor device and the next conductive terminal on said substrate to be interconnected by said fine wire, and wherein the included angle between said first wire interconnection and the next fine wire interconnection is greater than 60 degrees, and further includes the steps of:
making said second bond and breaking said fine wire at an included angle up to 60 degrees,
making a third dummy wire bond,
moving said capillary bonding tool a short vertical and horizontal distance in the direction of said fine wire interconnection to provide a properly angled direction bent end of said fine wire bent under said capillary bonding tool,
clamping said fine wire,
moving said capillary bonding tool in a path which is substantially aligned with the direction of said next fine wire interconnection, and
breaking said fine wire at said third dummy bond leaving the end of said fine wire bent and oriented in a proper direction for the next first bond.

13 more elements

Dependencies are inferred from the claim text.