Mounting device and method for detecting displacement
AssigneeYamaha Robotics Co., Ltd.
InventorsYuji Eguchi, Kohei Seyama
Life of this patent
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AssigneeYamaha Robotics Co., Ltd.
InventorsYuji Eguchi, Kohei Seyama
Estimating the term…
A mounting device includes: a bonding head having a cylindrical side surface; a support member supporting the bonding head; a first actuator causing the bonding head to advance and retreat in an axial direction thereof; a second actuator causing the bonding head to rotate around an axis thereof; a first scale provided on the cylindrical side surface for detecting displacement of the bonding head in the axial direction; a second scale provided on the cylindrical side surface for detecting displacement of the bonding head around the axis; a first sensor head which reads the first scale and outputs a first detection signal corresponding to displacement of the bonding head in the axial direction; and a second sensor head supported by the support member that reads the second scale and outputs a second detection signal corresponding to displacement of the bonding head around the axis.
A mounting device, comprising:
A method for detecting displacement which is a method for detecting displacement of a bonding head provided to a mounting device, the method for detecting displacement comprising:
Dependencies are inferred from the claim text.