H10W 72/07141
Means for applying energy
Official title: {Means for applying energy, e.g. ovens or lasers}
H10W72/07141 (Means for applying energy) appears on 3,413 US grants and 3,254 published applications in this corpus.
Search patents in H10W- Granted patents
- 3,413
- Published applications
- 3,254
- Assignees
- 771
- Inventors
- 5,457
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 11 | 0 |
| 1977 | 8 | 0 |
| 1978 | 7 | 0 |
| 1979 | 5 | 0 |
| 1980 | 5 | 0 |
| 1981 | 4 | 0 |
| 1982 | 5 | 0 |
| 1983 | 9 | 0 |
| 1984 | 14 | 0 |
| 1985 | 7 | 0 |
| 1986 | 18 | 0 |
| 1987 | 13 | 0 |
| 1988 | 22 | 0 |
| 1989 | 21 | 0 |
| 1990 | 32 | 0 |
| 1991 | 35 | 0 |
| 1992 | 39 | 0 |
| 1993 | 43 | 0 |
| 1994 | 41 | 0 |
| 1995 | 39 | 0 |
| 1996 | 32 | 0 |
| 1997 | 45 | 0 |
| 1998 | 49 | 0 |
| 1999 | 88 | 0 |
| 2000 | 88 | 0 |
| 2001 | 117 | 59 |
| 2002 | 104 | 112 |
| 2003 | 98 | 120 |
| 2004 | 97 | 100 |
| 2005 | 66 | 124 |
| 2006 | 75 | 121 |
| 2007 | 65 | 134 |
| 2008 | 69 | 141 |
| 2009 | 84 | 142 |
| 2010 | 118 | 133 |
| 2011 | 113 | 127 |
| 2012 | 111 | 116 |
| 2013 | 113 | 126 |
| 2014 | 94 | 135 |
| 2015 | 119 | 164 |
| 2016 | 146 | 157 |
| 2017 | 123 | 162 |
| 2018 | 142 | 156 |
| 2019 | 118 | 121 |
| 2020 | 137 | 178 |
| 2021 | 123 | 154 |
| 2022 | 128 | 140 |
| 2023 | 130 | 103 |
| 2024 | 111 | 95 |
| 2025 | 82 | 70 |
| 2026 | 50 | 64 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Bonding head and bonding apparatus6 Oct 2026US 12,752,380 B2Pac Tech—Packaging Technologies GmbH
- Wire bonding apparatus and control method8 Sep 2026US 12,728,478 B2Kioxia Corporation
- Bonding tool, semiconductor device manufacturing method, and semiconductor device1 Sep 2026US 12,727,501 B2Fuji Electric Co., Ltd.
- Method of assembly by direct bonding of electronic components25 Aug 2026US 12,721,248 B2Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Circuit board and manufacturing method18 Aug 2026US 12,713,535 B2NHK Spring Co., Ltd.
- Joining correction method24 Sep 2026US 2026/0284795 A1Tazmo Co., Ltd.
- Reflow method and system17 Sep 2026US 2026/0273640 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor Device and Method of Making Using Dual-Laser Compression Bonding17 Sep 2026US 2026/0282989 A1JCET STATS ChipPAC Korea Limited
- Automatic wire threading method and system27 Aug 2026US 2026/0250097 A1Asmpt Singapore Pte. Ltd.
- Capillary head with noncircular cone for wirebonding in semiconductor package manufacturing27 Aug 2026US 2026/0256014 A1
Most cited
By later US patents
- Semiconductor device475US 6,316,838 B1Fujitsu Limited · 2001
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- Three dimensional high performance interconnection package422US 5,371,654 AInternational Business Machines Corporation · 1994
- Method of planarizing tips of probe elements of a probe card assembly397US 5,974,662 AFormFactor, Inc. · 1999
- Multichip integrated circuit packaging configuration and method379US 4,783,695 AGeneral Electric Company · 1988