Bonding tool, semiconductor device manufacturing method, and semiconductor device

A bonding tool for bonding two conductive plates by pressing the bonding tool against the two conductive plates while vibrating the bonding tool in a direction parallel to the two conductive plates, the bonding tool comprising:

• a bonding end portion including
• a bonding base having an end surface, the end surface having
• a protrusion area having two sides that face each other and that extend in a first direction that is parallel to the end surface, and
• a pair of suppression areas respectively provided adjacent to and along the two sides of the protrusion area;
• a plurality of protrusions provided in the protrusion area of the end surface;
• and
• a pair of suppression portions respectively provided on the end surface in the suppression areas, and linearly extending between opposing ends of respective ones of the two sides of the protrusion area to sandwich the plurality of protrusions therebetween,
• wherein the bonding end portion is configured to vibrate in the first direction.