Semiconductor Device and Method of Making Using Dual-Laser Compression Bonding
AssigneeJCET STATS ChipPAC Korea Limited
InventorsYeojun Yun, SeungHyun Lee, HeeSoo Lee
Life of this patent
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Abstract
A semiconductor device manufacturing method has a first semiconductor die. A second semiconductor die is stacked over the first semiconductor die with a solder bump disposed between the first semiconductor die and second semiconductor die to form a semiconductor die stack. The semiconductor die stack is disposed between a first laser and a second laser. The solder bump is reflowed by emitting a first laser beam from the first laser onto the first semiconductor die and emitting a second laser beam from the second laser onto the second semiconductor die. The semiconductor die stack is disposed in a vacuum chamber while reflowing the solder bump.
Claims25
A method of making a semiconductor device, comprising:
- providing a first semiconductor die;
- stacking a second semiconductor die over the first semiconductor die with a solder bump disposed between the first semiconductor die and second semiconductor die to form a semiconductor die stack;
- disposing the semiconductor die stack between a first laser and a second laser;
- and
- reflowing the solder bump by,
- emitting a first laser beam from the first laser onto the first semiconductor die, and
- emitting a second laser beam from the second laser onto the second semiconductor die.
A method of making a semiconductor device, comprising:
- providing a first semiconductor die;
- stacking a second semiconductor die over the first semiconductor die with a solder bump disposed between the first semiconductor die and second semiconductor die to form a semiconductor die stack;
- emitting a first laser beam from a first laser onto the first semiconductor die;
- and
- emitting a second laser beam from a second laser onto the second semiconductor die.
A method of making a semiconductor device, comprising:
- providing a first semiconductor die;
- stacking a second semiconductor die over the first semiconductor die;
- emitting a first laser beam from a first laser onto the first semiconductor die;
- and
- emitting a second laser beam from a second laser onto the second semiconductor die.
A semiconductor manufacturing device, comprising:
- a semiconductor die stack;
- a first laser disposed over the semiconductor die stack;
- and
- a second laser disposed over the semiconductor die stack opposite the first laser.
Dependencies are inferred from the claim text.