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US 12,713,535 B2Granted
Circuit board and manufacturing method
AssigneeNHK Spring Co., Ltd.
InventorsRyo Tanaka, Yuichiro Yamauchi, Kohei Suzuki
Life of this patent
Estimating the term…
Abstract
A circuit board having a circuit pattern on a base plate and an additional metal layer laid and bonded on the circuit pattern, wherein the additional metal layer comprises an attachment plane portion configured to fix a semiconductor chip using solder, and an engagement uneven portion provided adjacent to the attachment plane portion, wherein the attachment plane portion is a face having unevenness smaller than the engagement uneven portion.
Claims17
A circuit board comprising:
- a base plate, a circuit pattern and an additional metal layer layered in this order, the additional metal layer layered and bonded on a partial area of the circuit pattern, wherein
- the additional metal layer comprises:
- an attachment plane portion provided on a surface of the additional metal layer and configured to fix an electronic component using solder;
- and
- an engagement uneven portion provided adjacent to the attachment plane portion on the surface of the additional metal layer to be engaged with a tool uneven portion of a tool for vibration transmission to bond the additional metal layer on the circuit pattern with ultrasonic vibration, wherein
- the attachment plane portion is a face having unevenness smaller than the engagement uneven portion.
3 more elements
A circuit board comprising:
- a base plate, a circuit pattern and an additional metal layer layered in this order, the additional metal layer layered and bonded on a partial area of the circuit pattern, wherein
- the additional metal layer comprises:
- an attachment plane portion provided on a surface of the additional metal layer;
- and
- an engagement uneven portion provided adjacent to the attachment plane portion on the surface of the additional metal layer to be engaged with a tool uneven portion of a tool for vibration transmission to bond the additional metal layer on the circuit pattern with ultrasonic vibration, wherein
- the attachment plane portion is a face having unevenness smaller than the engagement uneven portion.
3 more elements
Dependencies are inferred from the claim text.