H10W 72/07178
Means for aligning
Official title: {Means for aligning}
H10W72/07178 (Means for aligning) appears on 1,357 US grants and 1,429 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,357
- Published applications
- 1,429
- Assignees
- 428
- Inventors
- 2,528
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 2 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 3 | 0 |
| 1990 | 3 | 0 |
| 1991 | 4 | 0 |
| 1992 | 9 | 0 |
| 1993 | 7 | 0 |
| 1994 | 5 | 0 |
| 1995 | 7 | 0 |
| 1996 | 7 | 0 |
| 1997 | 17 | 0 |
| 1998 | 13 | 0 |
| 1999 | 26 | 0 |
| 2000 | 22 | 0 |
| 2001 | 38 | 21 |
| 2002 | 31 | 31 |
| 2003 | 27 | 17 |
| 2004 | 20 | 26 |
| 2005 | 11 | 23 |
| 2006 | 16 | 21 |
| 2007 | 19 | 31 |
| 2008 | 18 | 34 |
| 2009 | 18 | 54 |
| 2010 | 37 | 27 |
| 2011 | 25 | 34 |
| 2012 | 25 | 39 |
| 2013 | 35 | 61 |
| 2014 | 39 | 67 |
| 2015 | 53 | 90 |
| 2016 | 75 | 84 |
| 2017 | 74 | 93 |
| 2018 | 82 | 85 |
| 2019 | 85 | 96 |
| 2020 | 98 | 136 |
| 2021 | 93 | 109 |
| 2022 | 87 | 75 |
| 2023 | 91 | 67 |
| 2024 | 59 | 41 |
| 2025 | 48 | 34 |
| 2026 | 20 | 33 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Bonding head and bonding apparatus6 Oct 2026US 12,752,380 B2Pac Tech—Packaging Technologies GmbH
- IC chip mounting device and IC chip mounting method29 Sep 2026US 12,751,255 B2Sato Holdings Kabushiki Kaisha/ Sato Corporation
- Wire bonding arrays, maintenance stations for wire bonding arrays, and related methods22 Sep 2026US 12,745,664 B2Kulicke and Soffa Industries, Inc.
- Adhesive dispense unit25 Aug 2026US 12,721,090 B2Nexperia B. V.
- Method of assembly by direct bonding of electronic components25 Aug 2026US 12,721,248 B2Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Method and system for measuring and correcting die alignment error1 Oct 2026US 2026/0298625 A1
- Mounting device and method for detecting displacement1 Oct 2026US 2026/0305437 A1Yamaha Robotics Co., Ltd.
- Package method and package system17 Sep 2026US 2026/0282788 A1CXMT Corporation
- Methods of cutting a wire on a wire bonding system, and related cutting blades and wire bonding systems10 Sep 2026US 2026/0264165 A1Kulicke and Soffa Industries, Inc.
- Semiconductor module manufacturing device and semiconductor module manufacturing method10 Sep 2026US 2026/0271765 A1Rohm Co., Ltd.
Most cited
By later US patents
- Optical systems fabricated by printing-based assembly564US 7,972,875 B2The Board of Trustees of the University of Illinois · 2011
- Method for making semiconductor device having no die supporting surface430US 5,474,958 AMotorola, Inc. · 1995
- Optical systems fabricated by printing-based assembly346US 8,722,458 B2Semprius, Inc. · 2014
- Paddleless molded plastic semiconductor chip package291US 5,604,376 ADigital Equipment Corporation · 1997
- Method of transferring a micro device250US 8,333,860 B1LuxVue Technology Corporation · 2012