Semiconductor module manufacturing device and semiconductor module manufacturing method

A semiconductor module manufacturing method, the method comprising:

• holding a support and a semiconductor element by a carrier;
• and
• performing bonding of the support and the semiconductor element by causing, through relative movement, a first punch and a second punch to approach the support and the semiconductor element held by the carrier, the first punch approaching from a first side in a first direction, the second punch approaching from a second side in the first direction;
• wherein holding the support and the semiconductor element by the carrier includes placing the semiconductor element on the second side in the first direction with respect to the support,
• the semiconductor element includes a first ferromagnetic layer, and
• the carrier includes a magnet section positioned on the first side in the first direction with respect to the support.