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US 5,604,376 AGranted
Paddleless molded plastic semiconductor chip package
AssigneeDigital Equipment Corporation
InventorsWilliam R. Hamburgen, John S. Fitch, Yezdi N. Dordi
Life of this patent
Estimating the term…
Abstract
Disclosed is a semiconductor package and method in which a semiconductor chip is mounted within the opening of a lead frame by bonding wires extending between the active front side of the chip and bonding pads of the lead frame, and the lead frame/chip assembly is encased. within a plastic molded body, with the inactive back side of the chip exposed and facing outside the package.
Claims11
A molded semiconductor chip package comprising:
- a lead frame having an opening therein;
- a semiconductor chip having an active front side and a nonactive backside, said semiconductor chip having lateral dimensions smaller than those of the lead frame opening and being positioned within said lead frame opening with the nonactive backside of the semiconductor chip fully unsupported by said lead frame;
- bonding wires extending between the active front side of the semiconductor chip and bonding pads carried by the lead frame;
- and
- a molded body encasing said lead frame and said semiconductor chip with the nonactive back side of said semiconductor chip exposed and facing outside the package, said molded body including a stress relief feature which if a ring surrounding the outside edges of the semiconductor chip.
2 more elements
A molded semiconductor chip package comprising:
- a lead frame having an opening therein;
- a semiconductor chip having an active front side and a nonactive backside, said semiconductor chip having lateral dimensions smaller than those of the lead frame opening and being positioned within said lead frame opening;
- bonding wires extending between the active front side of the semiconductor chip and bonding pads carried by the lead frame;
- and
- a molded body encasing said lead frame and said semiconductor chip with the nonactive back side of said semiconductor chip exposed and facing outside the package and with said molded body including a stress relief notch disposed in said molded body.
2 more elements
A molded semiconductor chip package comprising:
- a lead frame having an opening therein;
- a semiconductor chip having an active front side and a nonactive backside, said semiconductor chip having lateral dimensions smaller than those of the lead frame opening and being positioned within said lead frame opening with the nonactive backside of the semiconductor chip fully unsupported by said lead frame;
- bonding wires extending between the active front side of the semiconductor chip and bonding pads carried by the lead frame;
- and
- a molded body encasing said lead frame and said semiconductor chip with the nonactive back side of said semiconductor chip being exposed, said molded body further including:
- an insert in a topside of said molded body, said topside being a surface of said molded body opposite said nonactive backside of the semiconductor chip.
3 more elements
A molded semiconductor chip package comprising:
- a lead frame having an opening therein;
- a semiconductor chip having an active front side and a nonactive backside, said semiconductor chip having lateral dimensions smaller than those of the lead frame opening and being positioned within said lead frame opening with the nonactive backside of the semiconductor chip fully unsupported by said lead frame;
- bonding wires extending between the active front side of the semiconductor chip and bonding pads carried by the lead frame;
- and
- a molded body encasing said lead frame and said semiconductor chip with the nonactive back side of said semiconductor chip exposed and facing outside the package, said molded body including a stress relief feature comprising a cover bonded to at least one side of the semiconductor chip package.
2 more elements
Dependencies are inferred from the claim text.