Method of transferring a micro device
AssigneeLuxVue Technology Corporation
InventorsAndreas Bibl, John A. Higginson, Hung-Fai Stephen Law, Hsin-Hua Hu
Life of this patent
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Abstract
A micro device transfer head and head array are disclosed. In an embodiment, the micro device transfer head includes a base substrate, a mesa structure with sidewalls, an electrode formed over the mesa structure, and a dielectric layer covering the electrode. A voltage can be applied to the micro device transfer head and head array to pick up a micro device from a carrier substrate and release the micro device onto a receiving substrate.
Claims30
A method of transferring a micro device comprising:
- positioning a transfer head over a micro device of 1 to 100 μm scale connected to a carrier substrate, the transfer head comprising:
- a mesa structure;
- an electrode over the mesa structure;
- and
- a dielectric layer covering the electrode;
- contacting the micro device with the transfer head;
- applying a voltage to the electrode to create a grip pressure on the micro device;
- picking up the micro device with the transfer head;
- and
- releasing the micro device onto a receiving substrate.
A method of transferring an array of micro devices comprising:
- positioning an array of transfer heads over an array of micro devices, wherein each micro device is of 1 to 100 μm scale and each transfer head comprises:
- a mesa structure;
- an electrode over the mesa structure;
- and
- a dielectric layer covering the electrode;
- contacting the array of micro devices with the array of transfer heads;
- selectively applying a voltage to a portion of the array of transfer heads;
- picking up a corresponding portion of the array of micro devices with the portion of the array of transfer heads;
- and
- selectively releasing the portion of array of micro devices onto at least one receiving substrate.
A method of transferring a micro device comprising:
- positioning a transfer head over a micro device of 1 to 100 μm scale on a carrier substrate;
- contacting the micro device with the transfer head;
- applying a voltage to the transfer head to create an electrostatic grip pressure on the micro device;
- picking up the micro device with the transfer head;
- and
- releasing the micro device onto a receiving substrate.
A method of transferring an array of micro devices comprising:
- positioning an array of transfer heads over an array of micro devices, wherein each micro device is of 1 to 100 μm scale;
- contacting the array of micro devices with the array of transfer heads;
- applying a voltage to the array of transfer heads to create an electrostatic grip pressure on the array of micro devices;
- picking up the array of micro devices with the array of transfer heads;
- and
- releasing the array of micro devices onto a receiving substrate.
Dependencies are inferred from the claim text.