Method for making semiconductor device having no die supporting surface

A method for fabricating a semiconductor device comprising the steps of:

• placing a semiconductor die having an active surface and a periphery on a supporting workholder;
• providing means for holding the semiconductor die rigidly on the supporting workholder for a subsequent electrical connecting step;
• providing a first plurality of conductors extending toward the periphery of the semiconductor die;
• electrically connecting the active surface of the semiconductor die to the first plurality of conductors;
• supporting an inactive surface of the semiconductor die with a support pin in a mold;
• molding a resin encapsulant inside a mold cavity having planar major surfaces to form a package body to cover the active surface of the semiconductor die and a portion of the plurality of conductors;
• and
• providing a second plurality of conductors electrically connected to the semiconductor die to provide external electrical connections.

A method for fabricating a semiconductor device comprising the steps of:

• placing a semiconductor die having an active surface and a periphery on a supporting workholder;
• providing means for holding the semiconductor die rigidly on the supporting workholder for a subsequent electrical connecting step;
• providing a first plurality of conductors extending toward the periphery of the semiconductor die;
• electrically connecting the active surface of the semiconductor die to the first plurality of conductors with connecting means, wherein said connecting means holds in place and physically supports the semiconductor die;
• supporting an inactive surface of the semiconductor die with a surface of a mold platen which defines part of a mold cavity;
• activating a vacuum line to rigidly hold the inactive surface against the mold platen surface;
• and
• transferring a resin encapsulant inside the mold cavity having planar major surfaces to form a package body to cover the active surface of the semiconductor die and a portion of the plurality of conductors;
• and
• providing a second plurality of conductors electrically connected to the semiconductor die to provide external electrical connections.

A method for fabricating a semiconductor device comprising the steps of:

• placing a semiconductor die having an active surface and a periphery on a supporting workholder;
• providing means for holding the semiconductor die rigidly on the supporting workholder for a subsequent electrical connecting step;
• providing a first plurality of conductors extending toward the periphery of the semiconductor die;
• electrically connecting the active surface of the semiconductor die to the first plurality of conductors;
• supporting a portion of an inactive surface of the semiconductor die with a pedestal which extends into a mold cavity;
• molding a resin encapsulant inside the mold cavity having planar major surfaces to form a package body to cover the active surface of the semiconductor die and a portion of the plurality of conductors;
• and
• providing a second plurality of conductors electrically connected to the semiconductor die to provide external electrical connections.

A method for fabricating a semiconductor device comprising the steps of:

• placing a semiconductor die having an active surface and a periphery on a supporting workholder;
• providing means for holding the semiconductor die rigidly on the supporting workholder for a subsequent electrical connecting step;
• providing a PCB substrate having a die cavity and a plurality of conductive traces on a surface of the PCB substrate, the plurality of conductive traces extending toward the periphery of the semiconductor die;
• electrically connecting the active surface of the semiconductor die to the first plurality of conductors;
• providing a removable tape that adheres to an inactive surface of the semiconductor die;
• forming a package body to cover the active surface of the semiconductor die and a portion of the plurality of conductive traces;
• removing a first portion of the tape from the inactive surface of the semiconductor die after the step of forming a package body, such that a second portion of the tape remains on the inactive surface forming a plurality of solder resist annular rings on the inactive surface;
• attaching a first plurality of solder balls to the inactive surface of the semiconductor die inside the plurality of solder resist annular rings;
• and
• attaching a second plurality of solder balls to the plurality of solder pads inside the plurality of recesses in the multilayer PCB substrate.