H10W 72/07168
Means for storing or moving the material for the connector
Official title: {Means for storing or moving the material for the connector}
H10W72/07168 (Means for storing or moving the material for the connector) appears on 340 US grants and 300 published applications in this corpus.
Search patents in H10W- Granted patents
- 340
- Published applications
- 300
- Assignees
- 165
- Inventors
- 718
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 0 | 0 |
| 1982 | 2 | 0 |
| 1983 | 2 | 0 |
| 1984 | 2 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 3 | 0 |
| 1988 | 2 | 0 |
| 1989 | 1 | 0 |
| 1990 | 5 | 0 |
| 1991 | 7 | 0 |
| 1992 | 3 | 0 |
| 1993 | 4 | 0 |
| 1994 | 5 | 0 |
| 1995 | 7 | 0 |
| 1996 | 3 | 0 |
| 1997 | 3 | 0 |
| 1998 | 4 | 0 |
| 1999 | 10 | 0 |
| 2000 | 8 | 0 |
| 2001 | 9 | 6 |
| 2002 | 6 | 7 |
| 2003 | 10 | 8 |
| 2004 | 4 | 6 |
| 2005 | 6 | 7 |
| 2006 | 3 | 5 |
| 2007 | 3 | 10 |
| 2008 | 5 | 7 |
| 2009 | 5 | 8 |
| 2010 | 12 | 9 |
| 2011 | 7 | 4 |
| 2012 | 7 | 7 |
| 2013 | 4 | 11 |
| 2014 | 5 | 13 |
| 2015 | 5 | 16 |
| 2016 | 14 | 22 |
| 2017 | 9 | 19 |
| 2018 | 20 | 15 |
| 2019 | 13 | 19 |
| 2020 | 21 | 25 |
| 2021 | 15 | 18 |
| 2022 | 19 | 16 |
| 2023 | 19 | 19 |
| 2024 | 14 | 11 |
| 2025 | 13 | 5 |
| 2026 | 9 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Apparatus for bonding clip, method of bonding clip, and semiconductor package including semiconductor chip to which clip is bonded using the method8 Sep 2026US 12,733,527 B2JMJ Korea Co., Ltd.
- Wire guides, wire bonding systems, and related methods1 Sep 2026US 12,727,503 B2Kulicke and Soffa Industries, Inc.
- Adhesive dispense unit25 Aug 2026US 12,721,090 B2Nexperia B. V.
- Ball mounting apparatus with ball attach volume control18 Aug 2026US 12,708,953 B2Texas Instruments Incorporated
- Apparatus and methods for tool mark free stitch bonding7 Jul 2026US 12,677,378 B2Skyworks Solutions, Inc.
- Automatic wire threading method and system27 Aug 2026US 2026/0250097 A1Asmpt Singapore Pte. Ltd.
- Wire guides, wire bonding systems, and related methods4 Jun 2026US 2026/0157211 A1Kulicke and Soffa Industries, Inc.
- Method of joining electrical and mechanical components using laminated modular preforms30 Apr 2026US 2026/0123502 A1Alpha Assembly Solutions Inc.
- Wire bonding apparatus16 Apr 2026US 2026/0107809 A1Samsung Electronics Co., Ltd.
- Thermocompression bonding head fixture9 Apr 2026US 2026/0101695 A1International Business Machines Corporation
Most cited
By later US patents
- Wafer level package using stud bump coated with solder135US 8,071,470 B2Carsem (M) Sdn. Bhd. · 2011
- Method of making constant bonding wire tail lengths134US 4,422,568 AKulicke and Soffa Industries, Inc. · 1983
- Process for dispensing semiconductor die-bond adhesive using a printhead having a microjet array and the product produced by the process129US 5,681,757 AMicroFab Technologies, Inc. · 1997
- Apparatus for supplying uniform tail lengths123US 4,771,930 AKulicke and Soffa Industries, Inc. · 1988
- Method and apparatus for forming bumps for semiconductor interconnections using a wire bonding machine123US 7,229,906 B2Kulicke and Soffa Industries, Inc. · 2007