Apparatus and methods for tool mark free stitch bonding
AssigneeSkyworks Solutions, Inc.
InventorAldrin Quinones Garing
Life of this patent
Estimating the term…
Abstract
Apparatus and method for tool mark free stich bonding. In some embodiments, a method for wire bonding can include feeding a wire through a capillary tip and attaching a first end of the wire to a first location, thereby forming a ball bond. The method can further include moving the capillary tip towards a second location while the wire feeds out of the capillary tip. The method can further include attaching a second end of the wire to the second location while preventing contact between the capillary tip and the second location, thereby forming a stitch bond without a tool mark at the second location.
Claims19
A method for wire bonding, the method comprising:
- feeding a wire through a capillary tip;
- attaching a first end of the wire to a first location, thereby forming a ball bond;
- moving the capillary tip towards a second location while the wire feeds out of the capillary tip;
- attaching a second end of the wire to the second location while preventing contact between the capillary tip and the second location, thereby forming a stitch bond without a tool mark created by the capillary tip at the second location;
- and
- after forming the stitch bond, moving the capillary tip farther from the second location in an opposite direction from the first location and contacting the second end of the wire with the capillary tip to form a security stitch bond at a location that is farther from the second location in the opposite direction from the first location, the stitch bond and the security stitch bond forming respective crescent shapes facing the same direction, a semicircular recessed area existing between the stitch bond and the security stitch bond.
A wire bonding system comprising:
- a handling apparatus configured to position a semiconductor die on a circuit board;
- and
- a wire bonding apparatus configured to feed a wire through a capillary tip and attach a first end of the wire to a first location thereby forming a ball bond, the wire bonding apparatus further configured to move the capillary tip towards a second location while the wire feeds out of the capillary tip, the wire bonding apparatus further configured to attach a second end of the wire to the second location while preventing contact between the capillary tip and the second location, thereby forming a stitch bond without a tool mark created by the capillary tip at the second location, the wire bonding apparatus further configured to, after forming the stitch bond, move the capillary tip farther from the second location in an opposite direction from the first location and contact the second end of the wire with the capillary tip to form a security stitch bond at a location that is farther from the second location in the opposite direction from the first location, the stitch bond and the security stitch bond forming respective crescent shapes facing the same direction, a semicircular recessed area existing between the stitch bond and the security stitch bond.
A method for wire bonding, the method comprising:
- using a capillary tool to form a ball bond on a surface of a first location and a stitch bond on a surface of a second location by feeding a wire out of a distal end of the capillary tool;
- preventing contact between the distal end of the capillary tool and the surface of the second location during formation of the stitch bond;
- and
- after forming the stitch bond, moving the distal end of the capillary tool farther from the second location in an opposite direction from the first location and contacting the stitch bond with the distal end of the capillary tool to form a security stitch bond at a location that is farther from the second location in the opposite direction from the first location, the stitch bond and the security stitch bond forming respective crescent shapes facing the same direction, a semicircular recessed area existing between the stitch bond and the security stitch bond.
Dependencies are inferred from the claim text.