Wire bonding apparatus
AssigneeSamsung Electronics Co., Ltd.
InventorsYounjo MUN, Byungwook KIM, Hoyoung SON, Junghyun LEE
Life of this patent
Estimating the term…
Loading patent…
AssigneeSamsung Electronics Co., Ltd.
InventorsYounjo MUN, Byungwook KIM, Hoyoung SON, Junghyun LEE
Estimating the term…
A wire bonding apparatus may include a wire supply portion configured to supply a conductive wire, a capillary configured to draw out the conductive wire supplied from the wire supply portion, and a wire holder disposed between the capillary and the wire supply portion. The wire holder has a first clamp and a second clamp that are spaced apart from each other and are configured to clamp the conductive wire. Each of the first clamp and the second clamp has a polygonal column shaped support body having with a plurality of contact surfaces along a circumference of each of the first clamp and the second clamp, and the polygonal column shaped support body is configured to rotate in a circumferential direction about a central axis of the polygonal column shaped support body.
A wire bonding apparatus, comprising:
A wire bonding apparatus, comprising:
A wire bonding apparatus, comprising:
Dependencies are inferred from the claim text.