Wire guides, wire bonding systems, and related methods
AssigneeKulicke and Soffa Industries, Inc.
InventorsAmey Vidvans, Christoph B. Luechinger, Frank Daniels, Tyler Ownby
Life of this patent
Estimating the term…
Abstract
A wire guide configured for use with a wire bonding system is provided. The wire guide includes a body portion configured to receive a wire. The body portion includes a tip portion at an end of the body portion. The tip portion defines an opening through which the wire exits the wire guide. The tip portion includes a protrusion adjacent the opening.
Claims20
A wire guide configured for use with a wire bonding system, the wire guide comprising:
- a body portion configured to receive a wire, the body portion including a tip portion at an end of the body portion,
- the tip portion defining an opening through which the wire exits the wire guide for bonding with a wedge bonding tool of the wire bonding system, the tip portion including a protrusion at the opening to localize stress on a surface of the wire as the wire is fed out from the wire guide.
A wire bonding system for forming wire bonds on a workpiece, the wire bonding system comprising:
- a support structure for supporting the workpiece during formation of a wire loop;
- a wire guide including a body portion configured to receive a wire, the body portion including a tip portion at an end of the body portion, the tip portion including an opening through which the wire exits the wire guide, the tip portion including a protrusion at the opening to localize stress on a surface of the wire as the wire is fed out from the wire guide;
- and
- a wedge bonding tool configured to bond the wire to the workpiece during formation of the wire loop.
A method of forming a wire loop using a wire bonding system, the method including the steps of:
- (a) forming a wire bond at a bonding location of a workpiece using a wedge bonding tool;
- and
- (b) feeding a wire, continuous with the wire bond, through a wire guide while moving the wedge bonding tool and the wire guide away from the bonding location after step (a), the wire contacting a protrusion at an opening through which the wire exits the wire guide to localize stress on a surface of the wire as the wire is fed out from the wire guide, the wire contacting the protrusion throughout step (b).
Dependencies are inferred from the claim text.