Wafer level package using stud bump coated with solder
AssigneeCarsem (M) Sdn. Bhd.
InventorsLily Khor, Yong Lam Wai, Lau Choong Keong
Life of this patent
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Abstract
A method of fabricated a wafer level package is described. In one embodiment, the method includes fabricating at least one active device on a semiconductor wafer that has not been singulated, with the active device having a plurality of bonding pads exposed at an upper surface of the wafer. Prior to singulating the semiconductor wafer, a plurality of corresponding stud bumps on the plurality of bonding pads with a wire bonding tool are formed. Thereafter, a molding encapsulation layer is applied over the semiconductor wafer leaving an upper portion of each of the plurality of stud bumps exposed.
Claims18
A method of fabricating a wafer-level package comprising:
- fabricating at least one active device on a semiconductor wafer that has not been singulated, the active device having a plurality of bonding pads exposed at an upper surface of the wafer;
- and
- prior to singulating the semiconductor wafer:
- (i) forming a plurality of corresponding metal stud bumps on the plurality of bonding pads using a wire bonding technique, and thereafter (ii) applying a molding encapsulation layer over the semiconductor wafer leaving an upper portion of each of the plurality of stud bumps exposed.
A method of fabricating a wafer-level package comprising:
- fabricating at least one active device on a semiconductor wafer that has not been singulated, the active device having a plurality of bonding pads exposed at an upper surface of the wafer;
- and
- prior to singulating the semiconductor wafer:
- (i) forming a plurality of corresponding stud bumps on the plurality of bonding pads, and thereafter (ii) applying a molding encapsulation layer over the semiconductor wafer leaving an upper portion of each of the plurality of stud bumps exposed;
- wherein the plurality of stud bumps formed on the plurality of bonding pads are copper stud bumps formed with a wire bonding tool from copper wire.
A method of fabricating a wafer-level package comprising:
- fabricating at least one active device on a semiconductor wafer that has not been singulated, the active device having a plurality of bonding pads exposed at an upper surface of the wafer;
- and
- prior to singulating the semiconductor wafer:
- (i) forming a plurality of corresponding stud bumps on the plurality of bonding pads, and thereafter (ii) applying a molding encapsulation layer over the semiconductor wafer leaving an upper portion of each of the plurality of stud bumps exposed;
- wherein the plurality of stud bumps formed on the plurality of bonding pads are gold or aluminum stud bumps formed with a wire bonding tool from gold or aluminum wire.
A method of fabricating a wafer-level package comprising:
- fabricating at least one active device on a semiconductor wafer that has not been singulated, the active device having a plurality of bonding pads exposed at an upper surface of the wafer;
- and
- prior to singulating the semiconductor wafer:
- (i) forming a plurality of corresponding stud bumps on the plurality of bonding pads, and thereafter (ii) applying a molding encapsulation layer over the semiconductor wafer leaving an upper portion of each of the plurality of stud bumps exposed;
- wherein the plurality of corresponding stud bumps formed on the plurality of bonding pads are stacked stud bumps formed by forming at least a second set of bumps directly overlying a first set of bumps, wherein each of the first and second sets of bumps are formed with a wire bonding tool.
A method of fabricating a plurality of wafer-level packages comprising:
- fabricating a plurality of active devices on a semiconductor wafer that has not been singulated, wherein each of the active devices has a plurality of bonding pads exposed at an upper surface of the wafer;
- and
- prior to singulating the semiconductor wafer to separate the plurality of active devices:
- (i) for each of the plurality of active devices, forming a plurality of copper stud bumps corresponding to the plurality of bonding pads associated with the active device using a wire bonding tool, (ii) applying a molding encapsulation layer over the semiconductor wafer leaving an upper portion of each of the plurality of stud bumps formed on each of the active devices exposed, (iii) applying solder paste over each of the exposed of copper stud bumps, (iv) reflowing the solder paste, and (v) cleaning the substrate with flux.
Dependencies are inferred from the claim text.