H10W 72/07163
Means for mechanical processing
Official title: {Means for mechanical processing, e.g. for planarising, pressing, stamping or drilling}
H10W72/07163 (Means for mechanical processing) appears on 127 US grants and 164 published applications in this corpus.
Search patents in H10W- Granted patents
- 127
- Published applications
- 164
- Assignees
- 80
- Inventors
- 328
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 3 | 1 |
| 2002 | 0 | 0 |
| 2003 | 1 | 2 |
| 2004 | 2 | 2 |
| 2005 | 1 | 0 |
| 2006 | 0 | 1 |
| 2007 | 0 | 0 |
| 2008 | 1 | 0 |
| 2009 | 2 | 3 |
| 2010 | 1 | 4 |
| 2011 | 0 | 2 |
| 2012 | 1 | 2 |
| 2013 | 1 | 4 |
| 2014 | 3 | 3 |
| 2015 | 4 | 11 |
| 2016 | 7 | 15 |
| 2017 | 7 | 8 |
| 2018 | 11 | 7 |
| 2019 | 4 | 9 |
| 2020 | 14 | 21 |
| 2021 | 12 | 8 |
| 2022 | 4 | 16 |
| 2023 | 17 | 14 |
| 2024 | 12 | 13 |
| 2025 | 13 | 11 |
| 2026 | 3 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Apparatus for bonding clip, method of bonding clip, and semiconductor package including semiconductor chip to which clip is bonded using the method8 Sep 2026US 12,733,527 B2JMJ Korea Co., Ltd.
- Sintering device and method16 Jun 2026US 12,654,414 B2Pink GmbH Thermosysteme
- Apparatus for applying a sintering force via a compressible film7 Apr 2026US 12,599,022 B2Asmpt Singapore Pte. Ltd.
- Wire bonding apparatus, wire bonding method and semiconductor device21 Oct 2025US 12,451,459 B2Yangtze Memory Technologies Co., Ltd.
- Flex bonded integrated circuits7 Oct 2025US 12,438,114 B2Meta Platforms, Inc.
- Joining correction method24 Sep 2026US 2026/0284795 A1Tazmo Co., Ltd.
- Methods of cutting a wire on a wire bonding system, and related cutting blades and wire bonding systems10 Sep 2026US 2026/0264165 A1Kulicke and Soffa Industries, Inc.
- Automatic wire threading method and system27 Aug 2026US 2026/0250097 A1Asmpt Singapore Pte. Ltd.
- Thermal compression bonding method and a compression head for performing such method16 Jul 2026US 2026/0206631 A1STATS ChipPAC Management Pte. Ltd.
- Method for bonding heat sink2 Jul 2026US 2026/0191022 A1Horng Terng Automation Co., Ltd.
Most cited
By later US patents
- Angled flying lead wire bonding process186US 6,295,729 B1International Business Machines Corporation · 2001
- Angled flying lead wire bonding process177US 6,708,403 B2International Business Machines Corporation · 2004
- Angled flying lead wire bonding process172US 6,526,655 B2International Business Machines Corporation · 2003
- Weakening wire supplied through a wire bonder128US 5,095,187 ARaychem Corporation · 1992
- Angled flying lead wire bonding process109US 7,495,342 B2International Business Machines Corporation · 2009