Angled flying lead wire bonding process
AssigneeInternational Business Machines Corporation
InventorsBrian Samuel Beaman, Keith Edward Fogel, Paul Alfred Lauro, Da-Yuan Shih
Life of this patent
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Abstract
A method is described having the steps of providing a surface having a plurality of wire bondable locations, wire bonding a wire to each of the wire bondable locations using a wire capillary tool; controlling the position of the capillary tool with respect to the substrate; after forming a wire bond of the wire to the wire bondable location moving the capillary tool relative to the surface as the capillary tool is moved away from the surface to form a wire having a predetermined shape.
Claims29
A structure comprising flying lead wire structures attached to an electronic circuit component comprising:
- said flying lead wire structures are bonded to a first surface of said electronic circuit component;
- said wire structures comprise a desired shape in said flying lead wire;
- said flying lead wire structures having wire tip ends comprising a shear blade cut end;
- said flying lead wires further comprise disposed in a predetermined position a sheet of material having a plurality of openings therein through which said flying lead wires project;
- wherein said sheet is spaced apart from said first surface of said electronic component by a flexible support;
- and
- wherein said flexible support is selected from the group consisting of a spring and an elastomeric material.
A structure comprising flying lead wire structures attached to an electronic circuit component comprising:
- said flying lead wire structures are bonded to a first surface of said electronic circuit component;
- said flying lead wire structures comprise a desired shape in said flying lead wire structures;
- wire tip ends comprising a small nick on opposite sides of said wires;
- said flying lead wires further comprise disposed in a predetermined position a sheet of material having a plurality of openings therein through which said flying lead wires project;
- wherein said sheet is spaced apart from said first surface of said electronic component by a flexible support;
- and
- wherein said flexible support is selected from the group consisting of a spring and an elastomeric material.
A structure comprising flying lead wire structures attached to an electronic circuit component comprising:
- said flying lead wire structures are bonded to a first surface of said electronic circuit component;
- said wire structures comprise a desired shape in said flying lead wire;
- said flying lead wire structures having wire tip ends comprising a shear blade cut end;
- said flying lead wires further comprise disposed in a predetermined position a sheet of material having a plurality of openings therein through which said flying lead wires project;
- wherein said sheet is spaced apart from said first surface of said electronic component by a flexible support;
- wherein a space between said surface of the electronic component and said sheet is filled with a compliant medium;
- and
- wherein said the compliant medium is an elastomeric material.
A structure comprising flying lead wire structures attached to an electronic circuit component comprising:
- said flying lead wire structures are bonded to a first surface of said electronic circuit component;
- said wire structures comprise a desired shape in said flying lead wire;
- said flying lead wire structures having wire tip ends comprising a shear blade cut end;
- said flying lead wires further comprise disposed in a predetermined position a sheet of material having a plurality of openings therein through which said flying lead wires project;
- wherein said sheet is spaced apart from said first surface of said electronic component by a flexible support;
- wherein a space between said surface of the electronic component and said sheet is filled with a compliant medium;
- and
- wherein said the compliant medium is a foamed polymer material.
A structure comprising flying lead wire structures attached to an electronic circuit component comprising:
- said flying lead wire structures are bonded to a first surface of said electronic circuit component;
- said flying lead wire structures comprise a desired shape in said flying lead wire structures;
- wire tip ends comprising a small nick on opposite sides of said wires;
- said flying lead wires further comprise disposed in a predetermined position a sheet of material having a plurality of openings therein through which said flying lead wires project;
- wherein said sheet is spaced apart from said first surface of said electronic component by a flexible support;
- wherein a space between said surface of the electronic component and said sheet is filled with a compliant medium;
- and
- wherein said the compliant medium is an elastomeric material.
A structure comprising flying lead wire structures attached to an electronic circuit component comprising:
- said flying lead wire structures are bonded to a first surface of said electronic circuit component;
- said flying lead wire structures comprise a desired shape in said flying lead wire structures;
- wire tip ends comprising a small nick on opposite sides of said wires;
- said flying lead wires further comprise disposed in a predetermined position a sheet of material having a plurality of openings therein through which said flying lead wires project;
- wherein said sheet is spaced apart from said first surface of said electronic component by a flexible support;
- wherein a space between said surface of the electronic component and said sheet is filled with a compliant medium;
- wherein said the compliant medium is a foamed polymer material.
Dependencies are inferred from the claim text.