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US 12,438,114 B2Granted
Flex bonded integrated circuits
AssigneeMeta Platforms, Inc.
InventorsSandeep Rekhi, Pradip Sairam Pichumani
Life of this patent
Estimating the term…
Abstract
Embodiments relate to an integrated circuit package having an integrated circuit die connected to a package substrate through conductors of a flex cable. The flex cable includes an insulating housing made of an insulating material and a plurality of conductors disposed inside the insulating housing. Each conductor of the plurality of conductors is connected to a first contact of a plurality of contacts of the integrated circuit die and a second contact of a plurality of contacts of the package substrate.
Claims20
An integrated circuit package comprising:
- an integrated circuit die implementing an integrated circuit, the integrated circuit die comprising a first plurality of contacts;
- a package substrate comprising a second plurality of contacts, each contact of the second plurality of contacts configured to be coupled to a contact of the first plurality of contacts;
- and
- a flex cable comprising:
- an insulating housing made of an insulating material, and
- a plurality of conductors embedded inside the insulating housing, each conductor of the plurality of conductors connected to a first contact of the first plurality of contacts and a second contact of the second plurality of contacts, wherein the plurality of conductors comprises a first set of conductors arranged in a first conductor layer formed in a first plane and a second set of conductors arranged in a second conductor layer formed in a second plane parallel to and spaced from the first plane in a first direction, wherein the second set of conductors are offset from the first set of conductors along a second direction normal to the first direction, wherein the flex cable is cut at an angle through the flex cable from a first surface of the flex cable to a second surface of the flex cable to expose the first set of conductors and the second set of conductors.
3 more elements
A method for connecting an integrated circuit die to a package substrate, comprising:
- cutting, by a flex cable bonding head, a flex cable along a first cut line at a first angle through the flex cable from a first surface of the flex cable to a second surface of the flex cable to expose a first surface of a plurality of conductors of the flex cable, wherein the plurality of conductors is embedded inside an insulating house of the flex cable, wherein the plurality of conductors comprises a first set of conductors arranged in a first conductor layer formed in a first plane and a second set of conductors arranged in a second conductor layer formed in a second plane parallel to and spaced from the first plane in a first direction, wherein the second set of conductors are offset from the first set of conductors along a second direction normal to the first direction;
- cutting, by the flex cable bonding head, the flex cable along a second cut line at a second angle to expose a second surface of the plurality of conductors of the flex cable;
- aligning the flex cable bonding head to a first plurality of contacts of the integrated circuit die;
- thermosonically bonding the first surface of the plurality of conductors to the first plurality of contacts of the integrated circuit die;
- aligning the flex cable bonding head to a second plurality of contacts of the package substrate;
- and
- thermosonically bonding the second surface of the plurality of conductors to the second plurality of contacts of the package substrate.
4 more elements
A system for connecting an integrated circuit die to a package substrate comprising:
- a tray holder for holding a tray carrying one or more integrated circuit stacks having the package substrate and the integrated circuit die;
- and
- a flex cable bonding head comprising:
- a first cutter for cutting a flex cable along a first cut line at a first angle through the flex cable from a first surface of the flex cable to a second surface of the flex cable to expose a first surface of a plurality of conductors of the flex cable, wherein the plurality of conductors is embedded inside an insulating housing of the flex cable, wherein the plurality of conductors comprises a first set of conductors arranged in a first conductor layer formed in a first plane and a second set of conductors arranged in a second conductor layer formed in a second plane parallel to and spaced from the first plane in a first direction, wherein the second set of conductors are offset from the first set of conductors along a second direction normal to the first direction,
- a second cutter for cutting the flex cable along a second cut line at a second angle to expose a second surface of the plurality of conductors of the flex cable, and
- a thermosonic bonding head for bonding the first surface of the plurality of conductors to a first plurality of contacts of the integrated circuit die and bonding the second surface of the plurality of conductors to a second plurality of contacts of the package substrate.
3 more elements
Dependencies are inferred from the claim text.